{"currentpage":1,"firstResult":0,"maxresult":10,"pagecode":5,"pageindex":{"endPagecode":5,"startPagecode":1},"records":[{"abstractinfo":"应用CAE(computer aided engineering)模拟仿真软件MSC.Marc,采用热力耦合弹塑性有限元分析模块,对纯银的挤压过程进行计算机模拟仿真.对挤压过程中银的流动情况进行分析,得出银的挤压流线与实际的情况相符,说明采用有限元软件模拟金属流动过程是可行的;对挤压过程中银所受到的应力应变进行分析,得出银在变形区内受到的应力最大,而银变形最剧烈的地方是从变形区进入定径带的部位.","authors":[{"authorName":"许福太","id":"7d0c1620-feb2-4bb2-b1b1-6c524b8eb2cc","originalAuthorName":"许福太"},{"authorName":"陈敬超","id":"c2e4cc98-32b6-49df-8c3f-fcaa12a5b668","originalAuthorName":"陈敬超"},{"authorName":"刘满门","id":"3142c246-21a2-4b6f-b49f-9a36ffc96327","originalAuthorName":"刘满门"},{"authorName":"武淑珍","id":"13c063d9-1098-41ca-a0b4-3860a8b4bdb3","originalAuthorName":"武淑珍"},{"authorName":"于杰","id":"4b89ede6-c93b-4092-a27a-dbce375ad318","originalAuthorName":"于杰"}],"doi":"","fpage":"1761","id":"fa2b1e4a-86b9-4ba7-a153-56d860940e62","issue":"10","journal":{"abbrevTitle":"XYJSCLYGC","coverImgSrc":"journal/img/cover/XYJSCLYGC.jpg","id":"69","issnPpub":"1002-185X","publisherId":"XYJSCLYGC","title":"稀有金属材料与工程"},"keywords":[{"id":"69a747d5-4bac-4093-b41c-18b58b42c922","keyword":"银挤压","originalKeyword":"银挤压"},{"id":"2c77a8a2-b8a3-43ee-93c0-089420aa738a","keyword":"应力","originalKeyword":"应力"},{"id":"26229284-f3b6-40d0-ae75-0772cc37ce59","keyword":"应变","originalKeyword":"应变"},{"id":"c387c3b9-093d-42b1-8c2b-120f044e2452","keyword":"有限元模拟","originalKeyword":"有限元模拟"}],"language":"zh","publisherId":"xyjsclygc200910016","title":"银大塑性变形的有限元模拟","volume":"38","year":"2009"},{"abstractinfo":"采用热挤压法成型制备出卤化银多晶光纤。光纤端面扫描电镜形貌分析结果显示，挤压温度120～210℃，晶粒大小基本不变，晶粒尺寸1～2μm。挤压温度＞210℃后，随着挤压温度升高挤压压力降低，在250℃时晶粒尺寸5～10μm，挤压温度的升高导致卤化银多晶光纤的晶粒长大，引起光纤散射损耗的增高。挤压模具中加入润滑剂可同时降低挤压压力和挤压温度，但引起光纤传输损耗的增加。","authors":[{"authorName":"高建平","id":"5f2ffa71-f048-459e-a5f9-6312025b89ba","originalAuthorName":"高建平"},{"authorName":"卞蓓亚","id":"eba789bd-1328-4c22-a4d3-86f13435ac31","originalAuthorName":"卞蓓亚"},{"authorName":"张议","id":"af483abe-9824-4268-9979-7a7085f4c764","originalAuthorName":"张议"},{"authorName":"武忠仁","id":"96b468ca-f56b-43e6-8c7f-ecc56f9ff68d","originalAuthorName":"武忠仁"}],"doi":"10.3321/j.issn:1000-324X.2001.03.026","fpage":"541","id":"2cc131d9-b381-46a5-8936-f1b60698b8a3","issue":"3","journal":{"abbrevTitle":"WJCLXB","coverImgSrc":"journal/img/cover/WJCLXB.jpg","id":"62","issnPpub":"1000-324X","publisherId":"WJCLXB","title":"无机材料学报"},"keywords":[{"id":"9b3076f0-7038-4f69-88e2-7ee555123dfe","keyword":"红外光纤","originalKeyword":"红外光纤"},{"id":"b39f5658-84a0-4b04-a612-e791d97c82f3","keyword":"卤化银","originalKeyword":"卤化银"},{"id":"4197ad44-2647-40de-b95d-2a0464ff2aeb","keyword":"热挤压成型","originalKeyword":"热挤压成型"},{"id":"064ffc24-4203-48eb-a54a-409fd40fb615","keyword":"显微结构","originalKeyword":"显微结构"}],"language":"zh","publisherId":"wjclxb200103026","title":"卤化银多晶光纤热挤压成型的研究","volume":"16","year":"2001"},{"abstractinfo":"本文基于刚粘塑性有限元理论,运用DEFORM3D软件对不同腔体参数(模口宽度、堵头高度和堵头截面形状)下的铜银合金连续挤压过程进行了模拟,重点分析了其对初始阶段应变、流速的影响.模拟结果表明,较小的模口宽度和较大的堵头高度有利于挤压成形和提高产品质量,而选择合理的堵头纵截面形状也能显著改善金属流动.这对腔体的优化设计有一定的指导作用.","authors":[{"authorName":"陆敏松","id":"1ae7e49d-415b-4491-9644-06a27e40f45a","originalAuthorName":"陆敏松"},{"authorName":"徐玉松","id":"eb71d611-6796-4e6e-8c3d-dad1e68d1fa6","originalAuthorName":"徐玉松"},{"authorName":"支海军","id":"3be2f09f-64e0-4160-9c64-1acfe5b45d02","originalAuthorName":"支海军"},{"authorName":"郑莉芬","id":"676a26aa-912d-4d67-8672-30201a68426d","originalAuthorName":"郑莉芬"}],"doi":"10.3969/j.issn.1003-1545.2010.03.006","fpage":"22","id":"2b2f2587-3b9b-43f5-8236-de51d26a97bb","issue":"3","journal":{"abbrevTitle":"CLKFYYY","coverImgSrc":"journal/img/cover/CLKFYYY.jpg","id":"10","issnPpub":"1003-1545","publisherId":"CLKFYYY","title":"材料开发与应用"},"keywords":[{"id":"57373356-6c4b-4c95-abc2-d0f92ea454b2","keyword":"铜银合金","originalKeyword":"铜银合金"},{"id":"18379c0e-ef73-4dd5-a54c-5130eafb3c12","keyword":"连续挤压","originalKeyword":"连续挤压"},{"id":"911505f5-6eac-41e8-b732-57b527fea6e8","keyword":"腔体结构","originalKeyword":"腔体结构"},{"id":"1d6a3787-abe7-4f5e-a58b-119145709ebf","keyword":"质量控制","originalKeyword":"质量控制"}],"language":"zh","publisherId":"clkfyyy201003006","title":"铜银合金连续挤压过程中腔体结构参数影响","volume":"25","year":"2010"},{"abstractinfo":"利用等径角挤压(ECAP)技术挤压铜银合金,对挤压后的铜银合金的组织和耐磨性能进行了研究.结果表明,ECAP实现了铜银合金晶粒的细化,由最初的5～6μm细化到2.5μm左右;并且硬度和耐磨性能都有提高,显微硬度提高70%,磨损失重降低19%左右.","authors":[{"authorName":"魏亮亮","id":"152adb12-54be-4d7e-a9d5-6ef68c0c85ef","originalAuthorName":"魏亮亮"},{"authorName":"侯英玮","id":"d1ab1c9d-b26f-435e-a9fb-2c9fbdf591ae","originalAuthorName":"侯英玮"}],"doi":"","fpage":"1196","id":"07952c24-17f7-4551-84e0-934a8036d0c8","issue":"7","journal":{"abbrevTitle":"GNCL","coverImgSrc":"journal/img/cover/GNCL.jpg","id":"33","issnPpub":"1001-9731","publisherId":"GNCL","title":"功能材料"},"keywords":[{"id":"0e5ef77c-75ed-4090-a072-e5907d989ade","keyword":"ECAP","originalKeyword":"ECAP"},{"id":"00509ac8-029e-4d78-b40c-776dd2f40921","keyword":"铜银合金","originalKeyword":"铜银合金"},{"id":"a3c26972-32a2-4dfa-b7f9-1ac852148132","keyword":"显微组织","originalKeyword":"显微组织"},{"id":"faacddc2-ec7f-42a5-ad38-163f3d9e43b4","keyword":"耐磨性能","originalKeyword":"耐磨性能"}],"language":"zh","publisherId":"gncl200907041","title":"ECAP对铜银合金组织和耐磨性能的影响","volume":"40","year":"2009"},{"abstractinfo":"采用数值模拟和实验研究方法分析圆形纯铝挤压件多道次等通道弯角挤压工艺,发现单道次挤压获得的挤压件的变形分布沿挤压件中心横截面竖直方向变形分布不均匀.通过节点映射法实现各工艺路线的多道次挤压,不同的工艺路线对应的多道次挤压变形分布具有明显差异.多道次挤压后晶粒得到显著细化,变形后晶粒结构较挤压前的退火等轴晶粒大为不同,而且各工艺路线的晶界取向也各不相同,其中旋转90.挤压能够获得大角度晶界分布的等轴晶粒试样,实验结果与有限元分析结果十分吻合.","authors":[{"authorName":"徐淑波","id":"65495f34-1620-4d53-aae3-e2d8c4427777","originalAuthorName":"徐淑波"},{"authorName":"张国良","id":"0aee67d5-1066-4725-9236-05d2687cbae2","originalAuthorName":"张国良"},{"authorName":"任国成","id":"8241526d-d261-4ab5-b4fa-d5ea05b7e3e4","originalAuthorName":"任国成"},{"authorName":"王志刚","id":"2c8dfedc-b52c-4a7b-9e96-4edd98bbe930","originalAuthorName":"王志刚"}],"doi":"","fpage":"1928","id":"59ca425e-d717-4d38-a19d-2a69861643b4","issue":"12","journal":{"abbrevTitle":"ZGYSJSXB","coverImgSrc":"journal/img/cover/ZGYSJSXB.jpg","id":"88","issnPpub":"1004-0609","publisherId":"ZGYSJSXB","title":"中国有色金属学报"},"keywords":[{"id":"21957f83-3961-42e4-b7fb-2711503f2733","keyword":"等通道弯角挤压","originalKeyword":"等通道弯角挤压"},{"id":"c5546d93-02be-47c2-b307-0455f5450bf3","keyword":"超细晶粒","originalKeyword":"超细晶粒"},{"id":"1344e4f9-1dfe-4ec2-8ded-6d46e09ab8b2","keyword":"有限元分析","originalKeyword":"有限元分析"},{"id":"dfa94bf1-bb75-4f3d-850b-b1300801a13a","keyword":"等轴晶粒","originalKeyword":"等轴晶粒"},{"id":"47cec979-321d-4158-8b7b-46fa5fde1d0b","keyword":"工艺路线","originalKeyword":"工艺路线"}],"language":"zh","publisherId":"zgysjsxb200712004","title":"圆形挤压件多道次等通道弯角挤压变形机理","volume":"17","year":"2007"},{"abstractinfo":"简略介绍了各种形式银纳米材料的制备方法以及银纳米材料的热学、低温、电学、力学、光学和光电等性质,初步分析了银纳米材料作为微电子材料、光学材料、催化材料、环保材料及高强高导材料的现有和潜在应用.","authors":[{"authorName":"宁远涛","id":"3237ca85-f528-4bf3-90b3-3e8d4b89a5f1","originalAuthorName":"宁远涛"},{"authorName":"赵怀志","id":"b370f528-2d1c-456f-a0ef-65fd10284bb2","originalAuthorName":"赵怀志"}],"doi":"10.3969/j.issn.1004-0676.2003.03.012","fpage":"54","id":"47345b0c-dafd-4dbf-978e-c65ecf341e3b","issue":"3","journal":{"abbrevTitle":"GJS","coverImgSrc":"journal/img/cover/GJS.jpg","id":"38","issnPpub":"1004-0676","publisherId":"GJS","title":"贵金属"},"keywords":[{"id":"6f4cd889-5030-4340-b763-327a8c441965","keyword":"金属材料","originalKeyword":"金属材料"},{"id":"43a70c80-ce0a-48ba-8da9-6905e2d60c84","keyword":"银","originalKeyword":"银"},{"id":"9032f31b-439f-4092-b451-1829d7e347b4","keyword":"纳米材料","originalKeyword":"纳米材料"},{"id":"4d06fb14-1146-49cc-83e0-db0c62937dad","keyword":"制备","originalKeyword":"制备"},{"id":"8fbb63f9-4192-486b-97ce-38638ea52bc4","keyword":"性质","originalKeyword":"性质"},{"id":"1a6498ea-6374-4a26-a054-c5521c1db01c","keyword":"应用","originalKeyword":"应用"}],"language":"zh","publisherId":"gjs200303012","title":"银纳米材料","volume":"24","year":"2003"},{"abstractinfo":"针对黄金行业生产中可能遇到的各种含银物料,结合前人的实践经验,对不同质量分数、不同性质的含银样品的分析方法进行了综合探讨.","authors":[{"authorName":"高平","id":"430c6439-0ddd-4490-862f-5ef4375b3462","originalAuthorName":"高平"},{"authorName":"徐清忠","id":"1f98a07d-577b-475c-8a3e-51ba47015300","originalAuthorName":"徐清忠"},{"authorName":"高东曙","id":"c9a0d396-1297-4a95-9710-e635ee046c19","originalAuthorName":"高东曙"},{"authorName":"郑小纯","id":"e3097933-e0af-4805-8d2a-7a08c885eb2e","originalAuthorName":"郑小纯"},{"authorName":"邹洪威","id":"58cf7f18-af73-4522-8500-1ccc5f1bdd46","originalAuthorName":"邹洪威"},{"authorName":"李延辉","id":"990b36a2-c556-41a9-b8ec-96e6cec1ee65","originalAuthorName":"李延辉"}],"doi":"10.3969/j.issn.1001-1277.2004.08.015","fpage":"44","id":"911cd69f-7d1d-4ce9-81af-a37a7bec5d39","issue":"8","journal":{"abbrevTitle":"HJ","coverImgSrc":"journal/img/cover/HJ.jpg","id":"44","issnPpub":"1001-1277","publisherId":"HJ","title":"黄金"},"keywords":[{"id":"9ab5a9da-4ba9-47cf-9129-f98f2e535c5f","keyword":"灰吹质量法","originalKeyword":"灰吹质量法"},{"id":"9ef15002-b9c7-45c4-83d3-27a43c0ec539","keyword":"湿法","originalKeyword":"湿法"},{"id":"50a21c24-c6c9-4e37-9911-97fd71063d45","keyword":"小试金质量法","originalKeyword":"小试金质量法"},{"id":"5fc86f84-180c-4b33-985e-bf0ec1b676e3","keyword":"冰铜相","originalKeyword":"冰铜相"},{"id":"54d85a8c-93df-4e4c-ae69-30ca4db6dea4","keyword":"测定","originalKeyword":"测定"}],"language":"zh","publisherId":"huangj200408015","title":"银的分析","volume":"25","year":"2004"},{"abstractinfo":"就宽幅型材生产而言,宽幅挤压与传统挤压相比能够有效降低能耗,已成为镁合金大规格产品加工的重要手段.除了形成所需形状尺寸的型材外,镁合金在挤压过程中晶粒得到细化,且细化程度随挤压比增加而提高,使得挤压镁合金的塑性和强度得到明显提高.对比不同参数下,宽幅挤压对A231镁合金组织结构和性能的影响,着重分析各向异性在改善组织性能中的作用.","authors":[{"authorName":"孔祥峰","id":"c663e864-f011-44ea-b038-89a327e0e05b","originalAuthorName":"孔祥峰"},{"authorName":"权高峰","id":"7da33f04-fe79-4223-9fc2-3cc6d45152a3","originalAuthorName":"权高峰"},{"authorName":"杨超凡","id":"51cfb92d-7462-4f18-b14c-159acd4e4beb","originalAuthorName":"杨超凡"}],"doi":"10.3969/j.issn.1004-244X.2011.03.014","fpage":"49","id":"90b19d5a-139a-4c45-b7e1-51f446fe731b","issue":"3","journal":{"abbrevTitle":"BQCLKXYGC","coverImgSrc":"journal/img/cover/BQCLKXYGC.jpg","id":"4","issnPpub":"1004-244X","publisherId":"BQCLKXYGC","title":"兵器材料科学与工程 "},"keywords":[{"id":"4ef8bb3b-288d-4db0-af24-2ed5a3201d25","keyword":"宽幅挤压","originalKeyword":"宽幅挤压"},{"id":"4c6223dc-8c80-483c-8fe8-5919e7d312ef","keyword":"AZ31","originalKeyword":"AZ31"},{"id":"5213cc3b-6b35-436f-beb3-1894c6c2e0dc","keyword":"各向异性","originalKeyword":"各向异性"},{"id":"440f8ef4-d1ba-4112-a387-6fa08df67d6e","keyword":"晶粒尺寸","originalKeyword":"晶粒尺寸"},{"id":"944baf0e-7a2a-4cf8-a2b9-321078a5f971","keyword":"性能","originalKeyword":"性能"}],"language":"zh","publisherId":"bqclkxygc201103014","title":"挤压比对镁合金宽幅挤压的影响","volume":"34","year":"2011"},{"abstractinfo":"通过对几种从氯化银中提取银的方法进行比较，提出了一种新的提银方法———氯化银直接水合肼提银（无氨）。该方法与氯化银传统提银方法相比，不仅工艺简单、回收率高，同时还具有还原纯度高、易操作，以及操作环境好、生产成本低等优点，是值得推广的工艺方法。","authors":[{"authorName":"宋裕华","id":"3bb32e3a-5f0e-48f9-8091-ecbef6a39070","originalAuthorName":"宋裕华"},{"authorName":"王维国","id":"8e2ea10e-2e4f-42cf-b5b4-95ed76652102","originalAuthorName":"王维国"}],"doi":"10.11792/hj20130614","fpage":"57","id":"68f32e89-f47e-4560-97b4-7fd5e2ffa61f","issue":"6","journal":{"abbrevTitle":"HJ","coverImgSrc":"journal/img/cover/HJ.jpg","id":"44","issnPpub":"1001-1277","publisherId":"HJ","title":"黄金"},"keywords":[{"id":"dbec74c5-e039-4aa0-824a-a95d9519bce3","keyword":"氯化银","originalKeyword":"氯化银"},{"id":"e98d5642-438e-4478-bd33-1f94b8c9431e","keyword":"水合肼","originalKeyword":"水合肼"},{"id":"fd302221-69c2-482d-8cf6-54d1e0a6f19f","keyword":"提银","originalKeyword":"提银"},{"id":"c20b7455-6f64-46aa-bafb-f263f7491e73","keyword":"方法","originalKeyword":"方法"}],"language":"zh","publisherId":"huangj201306018","title":"从氯化银中提取银的方法","volume":"","year":"2013"},{"abstractinfo":"使用热浸涂--电化学还原法制备了银/氯化银(Ag/AgCl)和银/卤化银(Ag/AgX)参比电极. 通过SEM观察发现电化学还原后的Ag/AgCl和Ag/AgX参比电极表面均有还原不均匀的现象. XRD分析表明, AgX晶体为AgCl和AgBr的固溶体, AgCl和AgX的晶型都为面心立方结构. 电化学性能测试表明Ag/AgCl参比电极的极化电阻和温度系数比Ag/AgX 参比电极小, Ag/AgCl电极电位稳定性略优于Ag/AgX电极. 在Br^-含量不同的溶液中测试表明Ag/AgCl参比电极电位受Br^-变化影响比Ag/AgX参比电极小.","authors":[{"authorName":"尹鹏飞","id":"3fc72bba-9ada-4e31-9455-aecb2356620c","originalAuthorName":"尹鹏飞"},{"authorName":"侯文涛","id":"012372a9-6db8-471f-bde0-39cd323066b8","originalAuthorName":"侯文涛"},{"authorName":"许立坤","id":"7c02383d-9196-41d6-a2d5-b3f0e5e632cb","originalAuthorName":"许立坤"},{"authorName":"王均涛","id":"2ed4f0c8-b9ab-4db4-a709-24116807f61b","originalAuthorName":"王均涛"},{"authorName":"辛永磊","id":"ff8b37e8-ad8c-4b73-a1cb-50537438d90b","originalAuthorName":"辛永磊"}],"categoryName":"|","doi":"","fpage":"407","id":"f008009a-78f6-496e-ad97-d87f15450bd5","issue":"5","journal":{"abbrevTitle":"FSXB","coverImgSrc":"journal/img/cover/腐蚀学报封面.jpg","id":"24","issnPpub":"2667-2669","publisherId":"FSXB","title":"腐蚀学报（英文）"},"keywords":[{"id":"0b6c184c-8f4d-44d7-8817-0efdeab2cdeb","keyword":"参比电极","originalKeyword":"参比电极"},{"id":"ee32b6b2-fdd8-4650-87ec-6610e52da0b4","keyword":"Ag/AgCl","originalKeyword":"Ag/AgCl"},{"id":"9be4857e-b061-43f4-9616-f04348a4856e","keyword":"Ag/AgX","originalKeyword":"Ag/AgX"}],"language":"zh","publisherId":"1002-6495_2010_5_2","title":"热浸涂银/氯化银和银/卤化银参比电极对比研究","volume":"22","year":"2010"}],"totalpage":404,"totalrecord":4034}