以酮酐型聚酰亚胺为基体，环氧树脂为改性剂，Al2O3为填料，采用Sol-Gel法制备了经过偶联剂KH550改性和未改性氧化铝的Al2O3/PI-EP杂化材料，利用红外光谱、扫描电镜、原子力显微镜等对杂化材料的微观结构进行了分析，并测试了材料的耐热性能和力学性能。结果表明：经过偶联剂KH550改性的Al2O3能更好地均匀分散在聚合物基体中，不易团聚，粒径尺寸较小，偶联剂起到了“架桥”的作用；6%Al2O3/PI-EP杂化材料的玻璃化温度为275℃，50~225℃时的储能模量下降较少，但225℃后会急速下降，与tanδ峰值区域的温度范围基本相对应，说明该材料可以在200℃的环境中长期使用保持其力学性能。
Using BTDA polyimde as matrix, epoxy resin as modifier, Al2O3 as filler, nano-Al2O3/PI-EP and KH550-Al2O3/PI-EP hybrid materials were prepared through sol-gel process. The microstructure of the materials was characterized by FT-IR, SEM and AFM, and their heat-resistance and mechanical properties were tested. The results show that the Al2O3 modified by KH550 can well dispersed in the polymer ma-trix, and the particle size is small. The coupling agent plays a role of“bridge”between PI-EP and na-no-Al2O3. The glass transition temperature of Al2O3/PI-EP hybrid material is 275℃ when the Al2O3 con-tent is 6%, and its storage modulus(E′) decreases a little between 50℃ and 225℃, then E′ decreases quickly after 225 ℃, and the temperature range is corresponding to the peak range of dielectric loss (tanδ), which indicate that the material can maintain the mechanical properties at 200℃.
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