采用微波辅助乙二醇还原法制备了不同长径比的银纳米方块及银纳米线,并对其进行了SEM,XRD表征.以不同长径比银纳米线作为导电填料制备了各向同性一导电胶.对导电胶的填充渗流IM值的研究发现,填料的长径比对填充渗流阈值的影响很大,长径比越大,渗流阈值越小.运用修正的阈值理论对这一实验现象进行了合理解释,模拟结果表明修正的阈值理论与实验结果非常吻合.
参考文献
[1] | Lee H H,Chou K S,Shih Z W.Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives[J].International Journal of Adhesion and Adhesives,2005,25(5):437-441. |
[2] | Lu D,Wong C P.Isotropic conductive adhesives filled with low melting point alloy filler[J].IEEE Transactions on Electronics Packaging Manufacturing,2000,23(1):185-190. |
[3] | Lu D,Wong C P.High performance conductive adhesives[J].IEEE Transactions on Electronics Packaging Manufacturing,1999,22(4):324-330. |
[4] | Yang R,Lu D,Wong C P.A study of impact performance of conductive adhesives[J].International Journal of Adhesion and Adhesives,2004,24(5):449-453. |
[5] | 杨波,陈光顺,李姜,郭少云.多壁碳纳米管增强碳黑/聚丙烯导电复合材料导电行为[J].复合材料学报,2009,26(4):41-46.Yang Bo,Chen Guangshun,Li Jiang,Goo Shaoyun.Multi-wall Carbon nanotubes enhanced conductive behaviors of CB/PP electrical conductive composites[J].Acta Materiae Compositae Sinica,2009,26(4):41-46. |
[6] | Krupa I,Mikova G,Novak I,et al.Electrically conductive composites of polyethylene filled with polyamide particles coated with silver[J].European Polymer,2007,43(6):2401-2413. |
[7] | Mamunya Y P,Davydenko V V,Pissis P,et al.Electrical and thermal conductivity of polymers filled with metal powders[J].European Polymer,2002,38(9):1887-1897. |
[8] | Fu Y,Liu J,Willander M.Conduction modeling of a conductive adhesive with distribution of conducting element[J].International Journal of Adhesion and Adhesives,1999,19(4):281-286. |
[9] | Li Y,Wong C P,Moon K S.Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids[J].IEEE Transactionson Components and Packaging Technologies,2006,29(1):173-178. |
[10] | Gelves G A,Lin B,SundararajU,et al.Low electrical percolation threshold of silverandcoppernanowiresin polystyrene[J].Advanced Functional Materials,2006,16(18):2423-2430. |
[11] | Sun Y,Gates B,Mayers B.Crystalline silver nanowires by soft solution processing[J].Nano Letters,2002,2(2):165-168. |
[12] | Mdluli P S,Revaprasadu N.Animproved N,N dimethylformamide and polyvinyl pyrrolidone approach for the synthesis of long silver nanowires[J].Journal of Alloys and Compounds,2009,469(1):519-522. |
[13] | Kan C,Zhu J,Zhu X.Silver nanostructure with well controlled shapes synthesis,characterization and growth mechanisms[J].Journal of Physics D:Applied Physics,2008,41(15):1-9. |
[14] | Goo L,Chipara M,Zaleski J M.Convenient,rapid synthesis of Ag nanowires[J].Chemstry of Material,2007,19(7):1755-1760. |
[15] | He X,Zhao X,Chen Y,et al.Synthesis and characterization of silver nanowires with zigzag morphology in N,Ndimethyformamide[J].Journal of Solid State Chemistry,2007,180(8):2262-2267. |
[16] | 吴海平,吴希俊,刘金芳,等.填充银纳米线各向同性导电胶的性能[J].复合材料学报,2006,23(5):24-28.Wu Haiping,Wu Xijun,Liu Jinfang,et al.Isotropical conductive adhesives filled with silver nanowires[J].Acta Materiae Compositae Sinica,2006,23(5):24-28. |
[17] | 吴海平,吴希俊,葛明园,刘化章,张国庆.填料粒径对各向同性导电胶渗滤阈值的影响[J].中国科学E辑:技术科学,2008,38(3):448-454.Wu Haiping,Wu Xijun,Ge Mingyuan,Liu Huazhang,Zhang Guoqing.The influence of filler size on the percolation threshold of ICA[J].Science in China E:Technology Science,2008,38(3):448-454. |
[18] | Xue Q Z.Modelforeffectivethermalconductivity of nanofluids[J].Physics Letters A,2003,307(1):313-317. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%