研究往复挤压Mg-4Al-2Si (AS42)合金的显微组织和晶粒细化机制.结果表明:挤压过程中发生受位错攀移控制的动态再结晶,随挤压道次的增加,合金的晶粒尺寸迅速减小;对合金挤压8道次后,得到晶粒细小、均匀分布的等轴晶组织,晶粒尺寸由铸态的45 μm减小至1.5 μm,此时,合金组织的细化趋于稳定,达到细化极限;晶粒细化机制是在往复挤压过程中通过累积动态再结晶,使再结晶得以彻底完成;增加位错密度和加剧晶界畸变使再结晶形核数目增多;大量挤压破碎、均匀分布的Mg2Si第二相颗粒成为再结晶形核核心,从而使晶粒得以细化;往复挤压11道次时,由于挤压温度过高,导致晶粒发生异常长大,最大尺寸约为10 μm.本试验条件下晶粒发生异常长大的温度阀值约为400 ℃.
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