热电元件焊接常用的焊料为铟基焊料和铋基焊料.由于碲化铋材料与低熔点合金焊料之间的浸润性较差,常在碲化铋基热电元件上镀覆镍镀层.本文在大气条件下,不加助焊剂,采用共晶SnBi和SnIn焊料分别对n型热电元件进行了铺展实验及界面显微组织的观察.铺展温度主要选择了210℃和300℃,实验表明300℃界面结合比250℃更好.此外,热电元件表面通过蒸镀仪蒸镀上薄镍层.对含薄镍层的热电元件与不含镍层的热电元件的铺展实验进行对比,得到薄镍镀层可能会增加界面裂纹.
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