针对目前严峻的电子组件散热形势,制造了高热流密度传热组件-均温板,并对其传热特性进行了研究.实验表明该均温板可承受非常高的热流密度.当加热功率达到170W时,热流密度超过了40W/cm2,均温板的上底面最高温度不超过85℃,从而表现出良好的均温和散热特性.热阻随加热功率的增大而减小,并逐渐趋于平缓.
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