氰化滚镀铜溶液中碳酸钠含量和主盐浓度不当,都会影响产品的质量.影响碳酸钠含量的因素较多,如溶液的pH值及NaOH浓度,槽电压等.对其具体影响进行了研究,提出措施:NaOH浓度在5.0～7.5 g/L可以将碳酸钠浓度控制在工艺范围内;降低镀槽电压和增加阳极面积有利于降低碳酸钠的浓度;较高的主盐浓度可以提高镀液的电流效率和均镀能力,有利于降低电镀成本.
The concentrations of sodium hydroxide and sodium carbonate in a barrel cyanide copper-plating bath were determined by chemical analysis, ai-ming at revealing the effect of sodium hydroxide on the formation and concentration of sodium carbonate and hence the quality of the final coating. Results show that the concentration of sodium carbonate in the bath for barrel cyanide copper- plating of zinc work pieces can be effectively controlled within the required range of technology by introducing 5.0 ～ 7. 5 g/L sodium hydroxide. Moreover, reducing the voltage of the plating bath and increasing the anodic area are favorable to decreasing the concentration of sodium carbonate. And raising the concentration of cuprous cya-nide as the main salt is helpful to increasing the current efficiency and throwing power and reducing the electroplating cost as well.
参考文献
| [1] | 张允诚;胡如南;向荣.电镀手册[M].北京:国防工业出版社,1997:302. |
| [2] | 曾华梁;吴仲达;秦月文.电镀工艺手册[M].北京:机械工业出版社,1989:821-823. |
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