研究了"离位"增韧对RTM聚酰亚胺(PI-9731)树脂基复合材料力学性能的影响.结果表明:当增韧剂的质量分数为15%时,经粉末法和薄膜法"离位"增韧G827/PI-9731复合材料的室温层间剪切强度从增韧前的97.9 MPa分别提高到108 MPa和110 MPa.高温(288℃)层间剪切强度变化不大.G827/PI-9731复合材料经粉末法"离位"增韧后,Ⅰ型断裂能释放率从增韧前的310 J/m2提高到410 J/m2,Ⅱ型断裂能释放率从增韧前的590 J/m2提高到939 J/m2.而经过薄膜法"离位"增韧后,其复合材料的I型断裂能释放率提高到459 J/m2,Ⅱ型断裂能释放率提高到1100 J/m2.经电镜分析表明,由于热塑性聚酰亚胺的引入,在复合材料层间区域形成热固/热塑相反转结构,在裂纹扩展的过程中,包覆热塑性聚酰亚胺的PI-9731粒子发生明显取向和变形,从而提高韧性.
参考文献
| [1] | Rikio Y,Syougo Y,Shoichiro Yet al.Molecular design of heat resistant polyimides having excellent processability and glass transition temperatue[J].High Performance Polymers,2001,13:61-72. |
| [2] | Hinkley J A.DSC study of the cure of a phenylethynylterminated imide oligomer[J].Journal of Advanced Materials,1996,27(3):55-59. |
| [3] | Hergenrother P M,Bryant B G.Phenylethynyl-terminated imides oligomers and polymers[J].Polymer Science Part A:Polymer Chemistry,1994,32,3061-3067. |
| [4] | Paul M H.The use,design,synthesis and properties of high performance/high temperature polymers:An overview[J].High Performance Polymer,2003,15:3-45. |
| [5] | Stewart B,Hideki O,Jim M C.Development of a cure/ postcure cycle for PETI-330 laminates fabricated by RTM[J].High Performance Polymers,2006,18:991-1001. |
| [6] | Rikio Y.Recent trends and space applications of polyimides[J].Journal of Photopolymer and Technology,1999,12:209-216. |
| [7] | Yuri S.L.Interracial regions in the phase-separated interpenetrating networks[J].Polymer Bulletin,2007,58..105-118. |
| [8] | Tang H,Dong L S,Zhang J,Din M X,Feng Z.Miscibility,crystallization,and morphology studies of thermosetting polyimide PMR-15/PEK-C blends[J].Journal of Application of Polymer Science,1996,60:725-730. |
| [9] | 李敏,张佐光,仲伟虹,等.聚酰亚胺树脂研究与应用进展[J].复合材料学报,2000,17(4):48.Li Min,Zhang Zuoguang,Zhong Weihong,et al.Study and application development of polyimides[J].Acta Materiae Compositae Sinica,2000,17(4):48. |
| [10] | Ruth H P.Interpenetrating polymer network approach to tough and microcraeking resistant high temperature polymer,Part Ⅰ:LaRC-RP40[J].SAMPEJournal,1998,24:25-32. |
| [11] | Ruth H P.Interpenetrating polymer network approach to tough and microcracking resistant high temperature polymer[J].Polymer Engineering and Science,1991,31(1):2033-2039. |
| [12] | Ruth H P.Interpenetrating polymer network approach to tough and microcracking resistant high temperature polymer,Part Ⅱ:LaRC-RP71[J].Polymer Engineering and Science,1991,31(1):28-33. |
| [13] | Tai H J,Jang B Z,Wang J B.Synthesis and processing of PMR-15/LaRC-TPI semi-IPN systems[-J].Application of Polymer Science,1995,58(3):2293-2306. |
| [14] | Chang K Y,Lee Y D.Molecular composite Ⅰ:Novel block copolymers of liquid I crystalline polyamide and amorphous polyimide:Synthesis and characterization[J].Journal of Polymer Science Part A,Polymer Chemistry,1993(31):2775-2784. |
| [15] | Chang K Y,Chang H M,Lee Y D.Molecular composite Ⅱ:Novel block copolymer and semi-interpenetrating polymer network of rigid polyamide and flexible polyimide[J].Journal of Polymer Science:Part A Polymer Chemistry,1994,32:2629-2639. |
| [16] | Liou H C,Paul S H,Betty T.Structure -property correlation for thin films of semi-interpenetrating polyimide networks Ⅰ:Miscibility,curing,and morphology studies[J].Journal of Application Polymer Science,1998,70:261-272. |
| [17] | 益小苏,许亚洪,程群峰,安学峰.航空树脂基复合材料的高韧性化研究进展[J].科技导报,2008,26(6):84-92.Yi Xiaosu,Xu Yahong,Cheng Qunfeng,An Xuefeng.Development of studies on polymer matrix aircraft composite materials highly toughened[J].Science and Technology,2008,26(6):84-92. |
| [18] | 唐邦铭,益小苏.一种通用的"离位"成形的增韧相制备技术及其高韧性复合材料:中国,200310102017.X[P].2008-06-25. |
| [19] | 益小苏,安学峰,唐邦铭.一种提高层状复合材料韧性的方法:中国,01100981.0[P].2001-03-26. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%