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  4. 高体积分数铝碳化硅复合材料研究进展

材料导报, 2012, 26(z1): 401-405.

高体积分数铝碳化硅复合材料研究进展

崔葵馨 1, , 常兴华 2, , 李希鹏 3, , 莫俳 4, , 王旭 5, , 金胜明 6,

1.中南大学资源加工与生物工程学院,长沙,410083

2.中南大学资源加工与生物工程学院,长沙,410083

3.中南大学资源加工与生物工程学院,长沙,410083

4.中南大学资源加工与生物工程学院,长沙,410083

5.中南大学资源加工与生物工程学院,长沙,410083

6.中南大学资源加工与生物工程学院,长沙,410083

关键词： SiCp/Al复合材料 , 高体积分数 , 性能 , 制备

Advances in Research on High Volume Fraction Aluminum Silicon Carbide Composites

阐述了高体积分数铝碳化硅复合材料的性能及影响因素,重点综述了各种制备方法的研究现状及其优缺点,阐述了目前存在的问题和下一步研究方向.

参考文献

[1] GJB 5443-2005.高体积分数碳化硅颗粒/铝基复合材料规范[S].国防科学技术工业委员会,2005.
[2] Thomas M P;King J E .Effect of thermal and mechanical processing on tensile properties of powder formed 2124 aluminum and 2124 AlSiC metal matrix composites[J].Materials Science and Technology,1993,9:742.
[3] Roebuck B .Fractography of a SiC particulate reinforced aluminum metalmatrix composite[J].Journal of Materials Science Letters,1987,6:1138.
[4] Vasudevan A K;Sadananda K .Fatigue crack growth of composites[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,1995,26:3199.
[5] Irving R R.Packaged for the road[J].American Society of Mechanical Engineers,2001
[6] 崔岩.碳化硅颗粒增强铝基复合材料的航空航天应用[J].材料工程,2002(06):3-6.
[7] 余志华,张建云,周贤良,邹爱华.电子封装SiCp/Al复合材料导热性能研究与进展[J].金属功能材料,2009(01):59-64.
[8] Lee H S;Jeon K Y;Kim H Y et al.Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications[J].Journal of Materials Science,2000,35:6231.
[9] Chihiro Kawai .Effect of Interfacial Reaction on the Thermal Conductivity of Al-SiC Composites with SiC Dispersions[J].Journal of the American Ceramic Society,2001(4):896-898.
[10] Arpon R;Molina J M;Saravanan R A .Thermal expansion coefficient and thermal hysterresis of Al/SiC composites with bimodal particle distributions[J].Materials Science Forum,2003,426-432:2187.
[11] 叶斌,何新波,任淑彬,曲选辉.SiC颗粒特性对无压熔渗SiCp/Al复合材料热物理性能的影响[J].北京科技大学学报,2008(12):1410-1413.
[12] Chen C-Y.;Chao C-G. .Effect of Particle-Size Distribution on the Properties of High-Volume-Fraction SiC_P-Al-Based Composites[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,2000(9):2351-2359.
[13] 于晓东,王扬卫,王富耻,张弛,纪涛.颗粒尺寸对SiCp/2024 Al复合材料性能的影响[J].特种铸造及有色合金,2007(09):672-673.
[14] 张强,陈国钦,武高辉,姜龙涛,栾伯峰.含高体积分数SiCp的铝基复合材料制备与性能[J].中国有色金属学报,2003(05):1180-1183.
[15] 万春锋,桑可正.无压浸渗法制备SiC/Al复合材料的抗弯强度研究[J].铸造技术,2005(11):1036-1038.
[16] Ye H;Liu X Y;Hong H .Fabrication of metal matrix composites by metal injection molding-A review[J].Journal of Materials Processing Technology,2008,200:12.
[17] Hunt M .Progress in powder metal composites[J].Materials and Engineering,1990,107(01):33.
[18] 王晓阳,朱丽娟,刘越.粉末冶金法制备AlSiC电子封装材料及性能[J].电子与封装,2007(05):9-11,15.
[19] Gupta M.;Ang SE.;Lu L. .EFFECT OF MICROSTRUCTURAL FEATURES ON THE AGEING BEHAVIOUR OF AL-CU/SIC METAL MATRIX COMPOSITES PROCESSED USING CASTING AND RHEOCASTING ROUTES[J].Journal of Materials Science,1997(5):1261-1267.
[20] G.W. Liu;M.L. Muolo;F. Valenza .Survey on wetting of SiC by molten metals[J].CERAMICS INTERNATIONAL,2010(4):1177-1188.
[21] Hashim J;Looney L;Hashmi M S J .The enhancement of wettability of SiC particles in cast alumimium matrix composites[J].Journal of Materials Processing Technology,2001,119:329.
[22] Schobel M;Altendorfer W;Degischer H P et al.Internal stresses and voids in SiC particle reinforced aluminum composites for heat sink applications[J].Composites Science and Technology,2011,71:724.
[23] S. Balasivanandha Prabu;L. Karunamoorthy;S. Kathiresan .Influence of stirring speed and stirring time on distribution of particles in cast metal matrix composite[J].Journal of Materials Processing Technology,2006(2):268-273.
[24] 张久兴;岳明;宋晓艳 等.放电等离子烧结制备功能材料的最新进展[J].功能材料,2010,7(04):15.
[25] Gu X F;Zhang L M;Yang M J et al.Fabrication by SPS and thermophysical properties of high volume fraction SiCp/Al matrix composites[J].Key Engineering Materials,2006,313:171.
[26] Chu K;Chengchang J;Wenhua T et al.Thermal conductivity of spark plasma sintering consolidated SiCp/Al composites containing pores numerical study and experimental validation[J].Composites Part A:Applied Science and Manufacturing,2010,41:161.
[27] 尹法章,郭宏,贾成厂,张习敏,张永忠.放电等离子烧结制备高导热SiC_P/Al电子封装材料[J].复合材料学报,2010(01):57-61.
[28] 何新波,张政敏,任淑彬,董应虎,曲选辉.高性能SiCp/Al电子封装壳体的近终成形[J].粉末冶金材料科学与工程,2010(02):157-161.
[29] Chu K;Jia C C;Liang X B et al.The thermal conductivity of pressure infiltrated SiCp/Al composites with various size distributions:Experimental study and modeling[J].Materials & Design,2009,30:3497.
[30] 谢志鹏,刘伟,杨现锋.陶瓷注射成型制备技术的研究与进展[J].中国材料进展,2011(01):21-25.
[31] Aggarwal G;Park S J;Smid I .Development of niobium powder injection molding:Part Ⅰ.Feedstock and injection molding[J].International Journal of Refractory Metals and Hard Materials,2006,24:253.
[32] 冯江涛,夏风,肖建中.陶瓷注射成型技术及其新进展[J].中国陶瓷,2003(02):34-38.
[33] Ha CG.;Jung YG.;Kim JW.;Jo CY.;Paik U. .Effect of particle size on gelcasting process and green properties in alumina[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2002(1/2):212-221.
[34] 王小锋,王日初,彭超群,李婷婷,罗玉林,王超,刘兵.凝胶注模成型技术的研究与进展[J].中国有色金属学报,2010(03):496-509.
[35] Wei Li;Hongxiang Zhang;Yanping Jin .Rapid coagulation of silicon carbide slurry via direct coagulation casting[J].Ceramics International,2004(3):411-416.
[36] 刘君武,李青鑫,吴金方,丁锋,郑治祥.粒度组成对高体积分数SiCp/Al复合材料性能的影响[J].材料热处理学报,2011(03):14-18.
[37] 吴金方,刘君武,丁锋,李青鑫,郑治祥.AlSiC电子封装材料的凝胶注模法制备[J].合肥工业大学学报（自然科学版）,2011(03):336-340.
[38] 宋晓岚;叶昌;余海湖.无机材料工艺学[M].北京:冶金工业出版社,2007
[39] 饶有海,邹爱华,刘园.SiCp/Al电子封装复合材料预制坯的制备[J].南昌航空大学学报（自然科学版）,2010(01):30-34.
[40] 熊德赣,杨盛良,白书欣,卓钺,赵恂.带金属密封环的AlSiC管壳制备与性能[J].电子与封装,2008(03):14-17,21.
[41] Hwu B;Lin S;Jahn M .Effects of process parameters on the properties of squeeze-cast SiCp-6061 Al metal-matrix composite[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,1996,207:135.
[42] Qiang Zhang;Gaohui Wu;Guoqin Chen .The thermal expansion and mechanical properties of high reinforcement content SiCp/Al composites fabricated by squeeze casting technology[J].Composites, Part A. Applied science and manufacturing,2003(11):1023-1027.
[43] 武高辉,张强,姜龙涛,陈国钦,修子扬.SiCp/Al复合材料在电子封装应用中的基础研究[J].电子元件与材料,2003(06):27-29.
[44] Nam T H;Requena G;Degischer P .Thermal expansion behaviour of aluminum matrix composites with densely packed SiC particles[J].Composites Part A:Applied Science and Manufacturing,2008,39:856.
[45] Chen N;Zhang H;Gu M et al.Effect of thermal cycling on the expansion behavior of Al/SiCp composite[J].Journal of Materials Processing Technology,2009,209:1471.
[46] 熊德赣,刘希从,赵恂,卓钺.铝碳化硅复合材料T/R组件封装外壳的研制[J].电子元件与材料,2003(02):17-19.
[47] 张志庆,于家康.Al/SiCp电子封装材料嵌入金属元件的组织与性能研究[J].热加工工艺,2008(02):1-4,8.
[48] 刘相权 .高体积分数SiC颗粒增强Al基复合材料的制备和性能研究[D].中南大学,2008.
[49] Jae-Chul Lee;Sung-Bae Park;Hyun-Kwang seok .Prediction of Si contents to suppress the interfacial reaction in the SiC_p/2014 Al composite[J].Acta materialia,1998(8):2635-2643.
[50] 张少卿,崔岩,王美炫,宋颖刚.碳化硅颗粒增强铝基复合材料的无压浸透反应机理探讨[J].材料工程,2001(12):8-11.
[51] Cui Y;Wang L;Ren J .Multi functional SiC/Al composites for aerospace applications[J].Chin J Aeronaut,2008,21:578.
[52] 曲选辉,任淑彬,吴茂,何新波,尹海清,秦明礼.高体分比SiCp/Al复合材料的近净成形技术[J].中国材料进展,2010(11):39-46.
[53] 叶斌,何新波,任淑彬,曲选辉.无压浸渗法制备高体分比SiCp/Al[J].北京科技大学学报,2006(03):269-273.
[54] Montoya-Davila M;Pech-Canul M I;Pech-Canul M A .Effect of SiCp multimodal distribution on pitting behavior of AlSiCp composites prepared by reactive infiltration[J].Powder Technology,2009,195:196.
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