采用电化学法研究Fe-W-P合金化学沉积工艺

材料保护, 2009, 42(2): 28-30.

采用电化学法研究Fe-W-P合金化学沉积工艺

张建辉 ^1, , 黄桂芳 ^2, , 刘玉玲 ^3, , 邹明亮 ^4,

1.湖南大学物理与微电子科学学院,湖南,长沙,410082;长沙环境保护职业技术学院,湖南,长沙,410004

2.湖南大学物理与微电子科学学院,湖南,长沙,410082

3.长沙环境保护职业技术学院,湖南,长沙,410004

4.湖南大学物理与微电子科学学院,湖南,长沙,410082;长沙环境保护职业技术学院,湖南,长沙,410004

关键词：化学沉积 , Fe-W-P合金 , 偶接铝 , 电化学法

Effect of Plating Bath Composition on the Deposition Behav-lor of Electroless Fe-W-P Ternary Alloy Coating

通过偶接金属铝,采用化学沉积方法制备Fe-W-P三元合金镀层,用电化学方法研究了镀液组成对Fe-W-P化学沉积行为的影响,并分析了偶接金属铝对合金沉积的诱导作用,对合金沉积的机理进行了初步探讨.结果表明,改变镀液组成和沉积工艺,沉积电位和沉积电流随之变化,增大镀液中NaOH和还原剂NaH2PO2·H2O的浓度,沉积电位负移,沉积速率增大,而随着钨酸钠的加入镀层的沉积速率稍有下降,表明钨酸钠对Fe-W-P的化学沉积有一定的抑制作用.偶接金属铝使体系的电位负移,降低了阴阳极极化电阻,诱导了Fe-W-P三元合金的共沉积.

参考文献

[1]	Ruscior C;Croiala E .Chemical iron phosphorus films[J].Journal of the Electrochemical Society,1971,18(05):696-699.
[2]	Hu W Y;Zhang B W .Electroless deposition of iron boron alloys[J].Transactions of the Institute of Metal Finishing,1993,71(01):30-35.
[3]	Zhang B W;Hu W Y;Zhu D Q .Magnetic properties of crystalline and amorphous Fe-B alloys prepared by electroless plating[J].Physica B,1993,183(1,2):205-210.
[4]	Hu W Y;Zhang B W .Structure and crystallization of amorphous FeB alloys obtained by chemical plating[J].Physica B,1991,175(02):396-400.
[5]	欧阳义芳.化学沉积铁磷合金[J].材料保护,1998(02):17.
[6]	L.Wang;L.Zhao;G.Huang .The Structure & Microhardness Of Ni-Fe-P & Ni-Fe-P-B Alloy Deposits Prepared by Electroless Plating[J].Plating & Surface Finishing,2001(6):92-95.
[7]	Wang L L;Zhao L H;Huang G F et al.The structure and crystallization of amorphous Ni-Fe-P-B alloys prepared by electroless plating[J].Zeitschrift fur Metallkunde,2001,92(04):391-395.
[8]	Yi Ge;Wang Lingling;Ouyang Yifang;Mao Liyong;Guo Ying;Zhang Bangwei;Xie Haowen .Preparation of Iron-Tungsten-Boron Alloy Deposits by Electroless Plating[J].Metal finishing,1996(11):31-32,34-35-0.
[9]	Huang G F;Huang W Q;Wang L L et al.Electrochemical study of electroless deposition of Fe-P alloys[J].Eelctrochem Acta,2006,51(04):4 471-4 476.
[10]	Petrov N;Sverdlov Y;Shacham-Diamand Y .Electrochemical study of the electroless deposition of Co,(P) and Co,(W.p) alloys[J].Journal of the Electrochemical Society,2002,149:C187-C194.
[11]	Huang G F;Deng J Q;Huang W Q.Influence of mctal salt ratio on Ni-Fe-P film by chemical process[J].International Journal of Electrochemical Science,2007(02):72-81.

上一张下一张

计量

下载量()
访问量()

作者相关

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%

材料期刊网

采用电化学法研究Fe-W-P合金化学沉积工艺

Effect of Plating Bath Composition on the Deposition Behav-lor of Electroless Fe-W-P Ternary Alloy Coating

参考文献