现代IT产业的发展催生了蓝牙技术的发展.而蓝牙技术的发展迫切需要发展高性能三维功能衬底技术.AlN陶瓷具有优良的综合性能.研究了AIN流延坯和Ag导体浆料的低温共烧技术,比较了在AlN成瓷基板上的各种金属化工艺.
参考文献
[1] | Kurihara Y.;Takahashi S. .Ag-Pd thick film conductor for AlN ceramics[J].IEEE transactions on components, hybrids, and manufacturing technology,1990(2):306-312. |
[2] | Terry R Bloom.The Reliability of AlN Power Hybrids Using Cu Thick Film Conductive[A].,1990:111. |
[3] | Young Chung-Gaw et al.[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1997,20(03):342. |
[4] | Osaka T.Chemical Etching Properties of Highly Thermal Conductive AlN Ceramics for Electroless Ni-P Metallization[J].Journal of the Electrochemical Society:Solid State Science and Technology,1998:2578. |
[5] | Osaka T.Metallization of AlN Ceramics by Electroless Ni-P Plating[J].Journal of the Electrochemical Society:Solid State Science and Technology,1986:2346. |
[6] | Bauer A et al.[J].Applied Surface Science,1990,46:113. |
[7] | Gross M E et al.[J].Applied Physics Letters,1985,47(09):923. |
[8] | Kuromitsu K et al.[J].Journal of Adhesion Science and Technology,1998,12(01):105. |
[9] | John M Segelken et al.[J].IEEE Transe CHMT,1992,15(04):438. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%