云纹干涉反转倍增技术研究Ti的应力腐蚀行为

腐蚀学报（英文）, 1998, 10(4): 32-36.

云纹干涉反转倍增技术研究Ti的应力腐蚀行为

清华大学工程力学系

北京航空航天大学5系

基金项目: 国家自然科学基金；金属腐蚀与防护国家重点实验室资助

关键词：云纹干涉 , micro multiplication , Ti , SCC , facilitation of deformation by anodic dissolution

STUDY ON SCC PROCESS OF Ti IN METHANOL KCl SOLUTION BY MEANS OF MICRO MULTIPLICATIVE MOIRE INTERFEROMETRY

ZHANG Tiancheng , LU Hong , CHU Wuyang (University fo Science and Technology of Beijing , Beijing 100083) ZHU Wanxu , LIU Baochen (Tsinghua University , Beijing 100084) SHI Xunqing (Beijing University of Aeronautics and Astronautics

Keywords： laser moire interferometry , 显微倍增 , 工业纯钛 , 应力腐蚀 , 溶解促进塑性变形

介绍了高灵敏度的激光云纹显微倍增技术,并用其研究了工业纯钛在甲醇+0.6mol/LKCl溶液中应力腐蚀时,缺口前端位移场和应变场的变化.结果表明,在应力腐蚀裂纹萌生前,0.6mol/LKCl的甲醇溶液对工业纯钛的阳极溶解(腐蚀)过程本身能使缺口前端的塑性区增大,与此同时,塑性区中各点的塑性变形量也相应增加,即溶解过程本身促进了局部塑性变形.

The changes of local displacement fields and local strain fields ahead of loaded notch for Ti in methanol+0.6 mol/L KCl solution have been investigated by the micro multiplicative moire interferometer technique. The results showed that the dissolution pro

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