Diamond/SnAgCu composite solder bumps were prepared on Cu pad by mechanically incorporating diamond particles into Sn3.0Ag0.5Cu (SAC) solder powders, mixing with flux and reflowing at 260℃ for 60 seconds. Spreading areas of composite solder were calculated and distributions of copper-coated diamonds were characterized. When diamond additions are below 3wt%, the spreading area decreases with diamond additions, and diamonds distributes mainly at the interface between solder and Cu pad; however, when additions are beyond 3wt%, discharge of diamond particle occurs, and the spreading area increases due to the reduction of surface energy.
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