以甲醛为还原剂,研究了2-巯基苯并噻唑(2-MBT)对ABS塑料化学镀铜沉积速率、铜镀层表面形貌、纯度、平整度及晶型的影响.化学镀铜的工艺条件为:CuSO4·5H2O 10g/L,EDTA-2Na30g/L,HCHO3mL/L,PEG-10002mg/L,2-MBT0～2mg/L,温度70℃或40℃,pH 12.5,时间1 h.镀液中加入低浓度2-MBT后,化学镀铜的混合电位正移,沉积速率提高,铜镀层的致密性和平整性得到改善,但镀层晶型变化不大.2-MBT在化学镀铜中只起配位和加速作用,所得铜镀层纯度较高.
参考文献
| [1] | GANDIKOTA S;MCGUIRK C;PADHI D.Characterization of electroless copper as a seed layer for sub-0.1μm interconnects[A].San Francisco:IEEE Electron Devices Society,2001:30-32. |
| [2] | ANDRYUSCHENKO T;REID J.Electroless and electrolytic seed repair effects on Damascene feature fill[A].San Francisco:IEEE Electron Devices Society,2001:33-35. |
| [3] | R(O)BER J;RIEDEL S;SCHULZ S E et al.Influence of carrier gas on Cunucleation,film properties and MOCVD reaction kinetics[J].Mieroelectronic Engineering,1997,37/38:111-119. |
| [4] | 胡光辉,杨防祖,吴辉煌.添加剂对化学镀铜的影响[J].电镀与涂饰,2002(03):24-28. |
| [5] | KONDO K;MURAKAWA K;NOMOTO K et al.Electroless copper plating solution and process for electrolessly plating copper[P].US,4834796,1989-05-30. |
| [6] | KONDO K;AMAKUSA S;MURAKAWA K et al.Electroless copper plating solution and process for formation of cooper film[P].US,5039338,1991-08-13. |
| [7] | Vaskelis A;Jaciauskiene J;Stalnionien I;Norkus E .Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2007(1):6-12. |
| [8] | OITA M;MATSUOKA M;IWAKURA C .Deposition rate and morphology of electroless copper film from solutions containing 2,2′-dipyridyl[J].Electrochimica Acta,1997,42(09):1435-1440. |
| [9] | Jun Li;Harley Hayden;Paul A. Kohl .The influence of 2,2/-dipyridyl on non-formaldehyde electroless copper plating[J].Electrochimica Acta,2004(11):1789-1795. |
| [10] | HANNA F;HAMID Z A;AAL A A .Controlling factors affceting the stability and rate of electroless copper plating[J].Materials Letters,2003,58(1/2):104-109. |
| [11] | PIATTI R C V;PODESTA J J .Study of the influence of additives on electroless copper deposition by gravimetric and microdensitometric techniques[J].Surface and Coatings Technology,1989,37(02):193-202. |
| [12] | AYCOCK T L;HUIE N C;KRAUSS G .The effects of stabilizing additives on the microstructure and properties of electroless copper deposits[J].Metallurgical and Materials Transactions,1974,5(05):1215-1223. |
| [13] | Li, ZX;Li, N;Yin, L;He, Y;Wang, ZL .An Environment-Friendly Surface Pretreatment of ABS Resin Prior to Electroless Plating[J].Electrochemical and solid-state letters,2009(12):D92-D95. |
| [14] | 马立涛,郭忠诚,朱晓云,王洪益.化学镀铜原理、应用及研究展望[J].南方金属,2009(02):20-23. |
| [15] | 杨志锋,高彦磊,李娜,王旭,殷列,王增林.超级化学镀铜填充微道沟的研究[J].化学学报,2009(24):2798-2802. |
| [16] | 谷新,王周成,林昌健.络合剂和添加剂对化学镀铜影响的电化学研究[J].电化学,2004(01):14-19. |
| [17] | 董超.添加剂对化学镀铜的影响[J].材料保护,1997(01):8. |
| [18] | YANG Z F;LI N;WANG X et al.Comparison of bottom-up filling in electroless plating with an addition of PEG,PPG and EPE[J].Electrochemical and Solid State Letters,2010,13(07):D47-D49. |
| [19] | ZAN L X;LIU Z H;YANG Z P et al.A synergy effect of 2-MBT and PE-3650 on the bottom-up filling in eloctroless copper plating[J].Electrochemical and Solid State Letters,2011,14(12):D107-D109. |
| [20] | Xu Wang;Na Li;Zhifeng Yang;Zenglin Wang .Effects of Triethanolamine and K_4[Fe(CN)_6] upon Electroless Copper Plating[J].Journal of the Electrochemical Society,2010(9):D500-D502. |
| [21] | Zhifeng Yang;Xu Wang;Na Li;Zhixiang Wang;Zenglin Wang .Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches[J].Electrochimica Acta,2011(9):3317-3321. |
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