采用脉冲电沉积工艺制备了铜沉积层,研究了电流密度、脉冲频率和占空比对铜镀层织构的影响.利用X射线衍射仪(XRD)和扫描电子显微镜(SEM)分析了铜镀层的织构和形貌.实验结果表明,低电流密度下为(200)晶面择优取向,高电流密度下为(111)晶面择优取向,频率越高则择优取向越强.低频脉冲下制备的沉积层平整致密.
The copper deposit was prepared by pulse electroplating process. The effects of current density, pulse frequency and duty cycle on the copper deposit texture were studied. The texture and morphology of copper deposit were analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM), respectively. The test results showed that the preferential orientation is (200) at lower current density and (111) at higher current density; the higher of the pulse frequency, the stronger is the preferential orientation. Smooth and compact copper deposit is obtained at low pulse frequency.
参考文献
| [1] | WATANABE T.Nano-Plating:Mierostructure Control Theory of Plated Film and Data Base of Plated Film Microstructure[M].Elsevier,2004 |
| [2] | K. Kremmer;O. Yezerska;G. Schreiber;M. Masimov;V. Klemm;M. Schneider;D. Rafaja .Microstructure formation in electrochemically deposited Copper thin films[J].Materialwissenschaft und Werkstofftechnik,2007(2):121-124. |
| [3] | 洪波,姜传海,王新建.电沉积铜薄膜中的内应力与织构特征[J].理化检验-物理分册,2007(08):392-394. |
| [4] | 赵鹏,浦玉萍.超声波对电沉积泡沫铜结构及性能的影响[J].中国表面工程,2008(01):45-47,49. |
| [5] | 张雅婷,徐章程,李菲晖.Si基上电沉积Cu薄膜的形貌与择优取向[J].人工晶体学报,2006(04):728-731. |
| [6] | 郭常霖,吴毓琴.层状结构铁电材料热压择优取向度的X射线测定法[J].物理学报,1980(12):1640-1644. |
| [7] | 周绍民.金属电沉积--原理与研究方法[M].上海:上海科学技术出版社,1987:242. |
| [8] | 辜敏,鲜晓红.（110）晶面全择优取向Cu镀层的制备及其条件优化[J].物理化学学报,2006(03):378-382. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%