采用化学镀工艺制备了镀铜SiC微粉.化学镀工艺参数对该复合粉体的包覆行为影响较大.利用冷压成型和无压烧结技术制备了SiCp/Cu基复合材料,并对该复合材料的微观结构和热膨胀系数进行研究.结果表明:SiC颗粒分布较均匀,SiC颗粒与基体之间界面结合良好；随测量温度增加,SiCp/Cu基复合材料的线膨胀系数呈非线性增加；当SiCp体积分数相同时,减小SiCp颗粒尺寸有利于降低复合材料的热膨胀系数.
参考文献
| [1] | Urquhart A W .Novel reinforced ceramics and metals a review of landxides composite technologies[J].Materials Science and Engineering,1991,A144:75-82. |
| [2] | Sunil Jha.CUVAR-a new controlled expansion,high conductivity material for electronic thermal managemen[A].Nevada:Lasvegas,1995:542-544. |
| [3] | Lee Y F;Lee S L;Chuang C L .Effects of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp composites[J].Powder Metallurgy,1999,42(02):147-152. |
| [4] | Shu Kuenming;Tu G C .The microstruture and thermal expansion characteristics of Cu/SiCp composites[J].Materials Science and Engineering,2003,A349:236-247. |
| [5] | Zhu Dezhi;Wu Gaohui;Chen Guoqin.Fabrication and properties of SiC/Cu composites for electronic packaging[A].广东深圳,2005:191-194. |
| [6] | Zou Guizhen;Cao Maosheng;Zhang Liang et al.A nanoscale core-shell of β-SiCp-Ni prepared by electroless plating at lower temperature[J].Surface and Coatings Technology,2006,201(1/2):108-112. |
| [7] | Xia CR.;Li FQ.;Peng DK.;Meng GY.;Guo XX. .Preparation of asymmetric Ni/ceramic composite membrane by electroless plating[J].Colloids and Surfaces, A. Physicochemical and Engineering Aspects,2001(2/3):229-235. |
| [8] | HE WANBAO;ZHANG BAOLIN;ZHUANG HANRUI .Preparation and sintering of Ni-coated Si_3N_4 composite powders[J].Ceramics International,2005(6):811-815. |
| [9] | Hui Wang;Jianfeng Jia;Hongzhang Song .The preparation of Cu-coated Al_2O_3 composite powders by electroless plating[J].CERAMICS INTERNATIONAL,2011(7):2181-2184. |
| [10] | Laima Luo;Jia Yu;Juan Luo;Jian Li .Preparation and characterization of Ni-coated Cr_3C_2 powder by room temperature ultrasonic-assisted electroless plating[J].CERAMICS INTERNATIONAL,2010(6):1989-1992. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%