本文系统研究了[011]多滑移取向铜单晶体在不同塑性应变幅下循环饱和后的表面滑移特征.结果表明，[011]多滑移取向铜单晶体的疲劳极限低于[001]多滑移取向铜单晶体.当应变幅γpl≥2.5×10－3时，表面出现两种宏观形变带（DBI和DBII）；它们呈严格的正交关系，其形成可能与循环加载中产生的不可逆晶体旋转密切相关.当应变幅γpl≥5.0×10－3时，表面还出现DBIII形变带，其惯习面为（001）；此类形变带的出现是［011］单晶体在高应变幅下循环达到峰值应力后出现明显循环软化现象的根本原因
Surface deformation features were investigated on [011] multiple-slip-oriented copper single crystals under different strain amplitudes. It is shown that the fatigue limit of [011]multiple-slip-oriented copper single crystal is lower than that of [001] multiple-slip-oriented copper single crystal. For γpl≥2.5×10-3, two types of deformation bands (DBI and DBII)formed on the specimen surface and their habit planes are perpendicular to each other strictly.This may be caused by the occurrence of irreversible rotation of crystal under cyclic loading. For γpl ≥5.0×10-3, another type of deformation band (DBIII) forms on the specimen surface and its habit plane is (001). The occurrence of the obvious cyclic softening processes, in cyclically deformed [011] copper single crystals with high strain amplitudes, was largely attributed to the
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