以γ-缩水甘油醚氧丙基三甲氧基硅烷为原料,通过水解缩聚制备出有机硅树脂,采用不同尺寸的改性氧化铝填充环氧/有机硅树脂基体以改善其耐热性能,并考察其力学性能、导热性能。结果表明,合成的有机硅树脂能提高封装胶的热分解温度,其热分解温度比环氧树脂高35.66℃。所制备封装胶的导热系数为1.01 W/（m.K）,相比单一环氧树脂其导热性能提高了约5倍,其粘接强度为10.27 MPa,该导热封装胶表现出良好的的综合性能,可用于微电子器件封装领域。
The organosilicon resin was synthesized from γ-（glycidoxypropyl）trimethoxysilane through the hydrolytic polycondensation.Various sizes of alumina were filled in the epoxy/organic hybrid resin.The thermal conductivity and mechanical property of thermal adhesive were analyzed.It is found that heat resisting property can be raised by organosilicon resin of which thermal decomposition temperature is increased by 35.66 ℃ compared to that of cured product of epoxy resin,the thermal conductivity of packaging adhesive is 1.01 W/（m·K） and increaseas by five times,the adhesive strength is 10.27 MPa,It can be concluded that this adhesive has better combination properties.This high thermal conductivity epoxy/organic hybrid packaging adhesive can be widely used in microelectronics devices.
参考文献
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