以木粉、正硅酸乙酯(TEOS)为原料,采用溶胶-凝胶方法将TEOS引入到木粉空隙中制备出木粉/TEOS杂化材料,在较低温度下烧结制得SiC木材陶瓷.采用热失重分析(TGA)、X射线衍射分析(XRD)、红外光谱(FT-IR)和扫描电镜(SEM)对其物相变化和显微结构进行了表征,用阿基米德法测定SiC木材陶瓷的显气孔率,研究了烧结温度和杂化材料增重率对SiC木材陶瓷摩擦性能的影响.研究结果表明,木粉/TEOS杂化材料在800 ℃时总的失重率仅为20%,是理想的SiC陶瓷前驱体;杂化材料中的Si-O-C结构可以在1000℃烧结成SiC;SiC木材陶瓷主晶相由β-SiC和SiO2组成,具有类似于木材的多孔拓扑结构;显气孔率随着烧结温度的升高先升后降,而随增重率的增加而增加;耐磨性能随烧结温度和增重率的增加而提高.
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