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The electromigration effect on interfacial reactions in Cu/90Sn-10Sb/Cu Pb-free solder joints was investigated under electric current stressing. The growth of the Cu(3)Sn and Cu(6)Sn(5) intermetallic compound (IMC) layers was enhanced at the anode but inhibited at the cathode, compared with the no-current case. The growth of the IMC at the anode followed a parabolic law. Upon increasing the temperature to about 140A degrees C, the thickness of the Cu(6)Sn(5) IMC at the anode increased significantly. Sn(3)Sb(2) IMC coarsened in the Cu(6)Sn(5) IMC at the anode and in the beta-Sn at the cathode. The possible mechanism of the electromigration effect is discussed.