Au-Ag-Ge三元相图,制备了新型Au-19.25Ag-12.80Ge(质量分数,%)钎料合金.利用DTA、扫描电镜对钎料的熔化特性及显微组织进行分析,并对其与纯Ni的润湿性加以研究.结果表明:钎料合金熔化温度为446.76～494.40℃.结晶温度区间为47.64℃.焊接温度在510～550℃范围内时,钎料合金与Ni的润湿性较好,同时有润湿环出现;钎料合金与Ni基体之间形成了一条明显的扩散层,能谱分析表明,该扩散层为Ge-Ni金属间化合物.采用先包覆铝热轧再冷轧,结合中间退火的加工工艺可制备厚度0.1mm的钎料薄带.
According to Au-Ag-Ge phase diagram,a novel-type Au-19.25Ag-12.80Ge(mass fraction,%)solder alloy was prepared.The melting characteristic and microstructure of the solder was analyzed by using DTA and scanning electron microscope,and its wettability with pure Ni was also studied.The results show that its melting temperature range is 446.76～494.40℃.and the temperature interval between the solidus and the liquidus is 47.64℃.When the soldering temperature is in the range of 510～550℃,the solder alloy has a good wettability with Ni and wetting ring appears.The interface structure observation reveals that there is one obvious diffusion layer between the solder alloy and base metal;X-ray energy spectrum analyzing results show that the diffusion layer is Ge-Ni intermetallics.Thin strip solder alloy with a thickness of 0.1 mm can be prepared by using the technique of hot-rolling after coated with aluminum alloy then cold-rolling together with intermediate annealing.
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