低模量、高延伸率有机硅密封材料的研究进展

功能材料, 2005, 36(3): 329-331.

低模量、高延伸率有机硅密封材料的研究进展

刘歆洁 ^1, , 胡洪国 ^2, , 陈春荣 ^3, , 林薇薇 ^4, , 郑强 ^5,

1.浙江大学,高分子科学与工程学系,浙江,杭州,310027

2.浙江大学,高分子科学与工程学系,浙江,杭州,310027

3.浙江大学,高分子科学与工程学系,浙江,杭州,310027

4.浙江大学,高分子科学与工程学系,浙江,杭州,310027

5.浙江大学,高分子科学与工程学系,浙江,杭州,310027

基金项目: 国家自然科学基金(50125312) 国家高技术研究发展计划(863计划)(2003AA327030)

关键词：低模量 , 高延伸率有机硅密封材料 , 有机硅 , 室温硫化

The process in study of organosilicone sealants with low modulus and high elongation

为适应现代建筑业的特殊工程要求,低模量、高延伸率有机硅密封材料成为近年来研究的热点.本文在简要介绍实现低模量、高延伸率的原理基础上,对其低模量、高延伸率有机硅密封材料的研究现状进行评述并对其发展趋势进行预测.

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材料期刊网

低模量、高延伸率有机硅密封材料的研究进展

The process in study of organosilicone sealants with low modulus and high elongation

参考文献