材料期刊网

Thermal fatigue properties of 200-nm-thick Au interconnects with a width of 2 mu m were evaluated by applying alternating current. We found that the temperature distribution along the Au interconnect can be described by a simplified one-dimensional equation of heat conduction. The lifetime as a function of thermal cyclic strain range (Delta(epsilon)) for the narrow Au lines follows the conventional Coffin-Manson relationship when Delta(epsilon) <= 0.47%, while the number of cycles to failure extends to an engineering-defined high-cycle fatigue region. (c) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.