从磁场分布和结晶器设计、磁场对铸坯表面质量改善的机理、电磁场作用下结晶器内弯月面的行为、磁场施加方式的演变等几个方面,综合论述了软接触结晶器电磁连铸技术的发展现状,并指出了该技术未来发展过程中值得注意的几个方面.
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