结合差示扫描量热曲线(DSC)和相图确定出热处理的温度范围.分别在真空和AgGa1-xInxSe2(x=0.2,0.6,0.8)多晶粉末包埋下,对ASGa0.4In0.6Se2晶体进行了热处理实验,分析了热处理对晶体性能的影响.结果表明:用x=0.6和0.8的多晶粉末包埋,在680℃下保温120 h后再淬火处理的晶片,其红外透过率在550～5500 cm-1波数范围内整体提高到65%以上,光学质量显著提高;EDX和XRD分析表明,采用AgGa0.2In0.8Se2多晶粉末包埋,能够补充晶片中的In缺失,成分更接近AgGa0.4In0.6Se2化学计量比,同时晶片结晶质量也得到明显改善.
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