基于Cu和Sn元素在焊接界面扩散结构(Cu/Cu3Sn/Cu6Sn5/Sn)中的扩散通量比理论模型,将SnX5.0Cu1.5Ni焊点在180℃进行等温时效,研究SnX5.0Cu1.5Ni焊点中金属间化合物(Intermetallic Compound,IMC)的Cu3Sn与Cu6Sn5两相组织形貌演变和生长行为.结果表明:SnX5.0Cu1.5Ni界面金属间化合物的Cu3Sn与Cu6Sn5两相增厚主要由扩散机制控制,Cu3Sn相生长速率为4.16×10-18m2/s,Cu6Sn5生长速率为1.06×10-17 m2/s.在时效初期,IMC的形态呈扇贝形状,此时Cu3Sn快速生长,并消耗Cu6Sn5层,因此Cu6Sn5在时效初始阶段厚度降低,Cu3Sn厚度升高;随着时效时间的延长,IMC的形态向着平层形状转变,Cu3Sn的生长速率降低,对Cu6Sn5层的消耗也逐步减少;随着时效时间的进一步延长,Cu3Sn和Cu6Sn5的厚度继续增大,使得金属化合物在应力过大而破裂.
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