利用界面聚合法对问位芳纶进行表面接枝改性,制备出新型具有液晶性能的芳纶.采用傅立叶转换红外光谱(FT-IR)对芳纶表面结构进行表征.由扫描电子显微镜(SEM)照片可以看出,改性后的芳纶表面变得粗糙,改性后纤维直径约为20μm.利用差示扫描量热法(DSC)对改性后纤维进行热性能分析,结果表明纤维具有液晶性能,在升、降温过程中的介晶相范围分别为192℃～237℃和147℃～209℃.接枝改性后的芳纶可以增加纤维与基体间的界面粘合性,提高复合材料的力学性能.
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