采用SPS法制备了p-型四元Al-Bi-Sb-Te合金,研究其微结构和热电性能.结果表明:Al含量直接影响材料的电、热学输运性能.当材料中Al替代Sb元素后,四元合金AlxBi0.5Sb15-xTe3(x=0.05～0.2)的电导率明显增大;在室温附近,x=0.1的合金其电导率可达3.3×104Ω-1·m-1,大约是三元Bi0.5Sb1.5 Te3合金的2倍;四元合金系的最小Seebeck系数α为115μV/K,说明材料属p-型半导体;当温度为411 K时,合金AlxBi0.5-Sb1.5-xTe3(x=0.1)的ZT值出现最大值,其值为0.58,是同温度下典型三元Bi0.5Sb1.5Te3合金的1.6倍.
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