在PC/ABS熔融共混的聚合物中掺杂Cu基金属化合物制得改性塑料，运用适当激光参数活化其表面，对此改性塑料表面进行化学镀铜．利用扫描电镜（ SEM）、X射线能谱分析（ EDS）、X射线光电子能谱分析（ XPS）及电子显微镜对其活化层进行表征，结果表明：活化层中Cu元素以亚铜离子（ Cu＋）的形式构成亚铜化合物．亚铜离子（ Cu＋）在特定环境下发生歧化反应，对化学镀铜过程起到催化作用；通过镀层形态和性能测试分析，镀层表面光亮平整，结构致密，与基体结合力强，电阻率为：1．8～2．2μΩ·cm．镀层性能良好，表明可以用亚铜化合物来替代传统化学镀铜的贵金属催化剂．
A modified plastic was produced via a polymer doped with copper-base metal compounds by melt blending with PC and ABS. Its surface was activated under appropriate laser parameters, then electroless copper plating was applied. The activated layer was characterized by SEM, EDS, XPS and electron microscope. The results indicated that Cu element in the activated layer constituted a cuprous compound as in the form of cuprous ion ( Cu+) . Cuprous ion ( Cu+) takes the disproportionation reaction in a special environment, and has catalytic effect on the process of electroless copper plating. The copper plating layer has the properties of bright and smooth surface, dense microstructure and strong binding force with the base by analyzing the morphology. The electrical resistivity is 1.8~2.2μΩ·cm. The plating possesses good properties, which indicates that the cuprous compound can be used to replace the noble metal catalysts in the traditional electroless copper plating.
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