Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

材料科学技术（英文）, 2007, 23(1): 81-84.

^1, , ^2, , ^3,

1.State Key Laboratory of Materials Modification by Laser, Ion and Electron Beams, Dalian University of Technology, Dalian 116024, China;School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China

2.School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China

3.School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China

基金项目: 辽宁省自然科学基金(20041078)

Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

Keywords： Lead-free solder

The microstructure and melting behavior of Sn-9Zn-2Cu (SZC) lead-free solder with 3 wt pct Bi and various amount of Ni additions were studied. The wetting properties and the interracial reaction of Sn-Zn-Cu with Cu substrate were also examined. The results indicated that the addition of 3 wt pct Bi could decrease the melting point of the solder and Ni would refine the microstructure and the rod-shape Cu5Zn8 phase changed into square-shape (Cu, Ni)5Zn8 phase. The addition of Bi, Ni greatly improved the wettability of SZC solder.In addition, the interfacial phase of the solders/Cu joint was typical planar Cu5Zn8 in SZC-3Bi-INi alloy.

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Effect of a Trace of Bi and Ni on the Microstructure and Wetting Properties of Sn-Zn-Cu Lead-Free Solder

参考文献