使用溅射镀膜法在纯铜片上溅射金属Mo，将表面改性后的铜片作为电极，利用电声脉冲法(PEA)测试不同溅射电压制备的铜片作电极时交联聚乙烯(XLPE)内的空间电荷分布情况。结果表明：随着制备铜片电极时溅射电压的增加，注入XLPE内的空间电荷量减少，溅射电压为440V时，XLPE内部几乎没有空间电荷积聚。将PEA测试后的XLPE试样进行热刺激电流(TSC)分析，发现镀Mo后，随着溅射电压的升高，被陷阱捕获的空间电荷量逐渐减小。
A pure copper sheet was sputtered molybdenum by magnetron sputtering method, and the modi-fied copper sheet was used as electrode, then the space charge distribution in XLPE was tested by pulsed electro-acoustic (PEA) method when the copper electrode was prepared under different sputtering voltages. The results show that with the increase of sputtering voltage, the injected space charge amount in XLPE decrease. When the sputtering voltage is 440 V, little space charge accumulates in the XLPE. The XLPE samples were conducted thermally stimulated current(TSC) test after PEA test, and we found that with the increase of sputtering voltage, the space charge amount captured by trap decreased gradually.
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