通过对大功率LED多层材料的封装结构进行建模及数值分析,得到稳态的温度场分布、芯片最高温度与环境温度、LED功率的变化关系,并利用热阻模型对材料散热效率进行了优化.对于单一肋片,存在一个使其热阻最小的最佳肋厚.对于肋片组散热器,肋片数量较少时也能使散热器总热阻较小,且应尽量使肋片厚度接近单个肋片热阻最小时的厚度,以更少的肋片数量获得较小的散热器总热阻,这样既能控制芯片的最高温度,又可有效地节约成本.
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