欢迎登录材料期刊网

材料期刊网

高级检索

采用DSC、Ozawa法、固态13C核磁共振(13C NMR)、红外光谱(IR)、裂解-气相色谱(Py-GC)和XRD研究了硼改性酚醛树脂的固化动力学、固化机制和裂解行为。结果表明:硼改性酚醛树脂的近似凝胶温度、固化温度和后处理温度分别为350.0 K、386.2 K和433.3 K,固化反应峰顶的活化能为152.4 kJ/mol;硼改性酚醛树脂的固化反应主要包括PhCH2—OH之间的反应、PhCH2—OH与B—OH之间的反应、PhCH2—OH与酚环上活泼氢之间的反应,以及醚键的歧化反应。硼改性酚醛树脂的剧烈分解温度为500~800℃,失重为14.9%;裂解生成的挥发物有CO、CO2、H2O、苯和甲苯等;在1000℃时的残碳率为67.2%;硼改性酚醛树脂在1000℃高温裂解30 min后生成了玻璃碳。

The curing kinetics,curing mechanism and pyrolysis of boron-modified phenolic resin were investigated by means of non-isothermal DSC technique,Ozawa method,solid-state 13C nuclear magnetic resonance(NMR),infrared spectrum(IR),pyrolysis-gas chromatography(Py-GC)and XRD.The results show that the approximate theoretical temperatures of gel,cure and post-treatment are 350.0 K,386.2 K and 433.3 K,respectively.Its apparent activation energy at exothermic peak is 152.4 kJ/mol.The curing process involves the reactions of PhCH2—OH to itself,PhCH2—OH to B—OH,PhCH2—OH to H of phenol ring as well as disproportionation of ether link.The mass loss at the range of 500 ℃ to 800 ℃ in the pyrolysis is 14.9%,and the pyrolysis products are mainly volatile compounds,such as CO,CO2,H2O,benzene and toluene.The residual carbon value at 1000 ℃ is 67.2%.The boron-modified phenolic resin is pyrolyzed into glass carbon after the heat-treatment at 1000 ℃ for 30 min.

参考文献

[1] 邱军, 王国建, 冯悦兵. 不同硼含量硼改性酚醛树脂的合成及其性能 [J]. 同济大学学报: 自然科学版, 2007, 35(3): 381-384.
[2] 刘喜宗, 李贺军, 马托梅, 等. 硼酚醛树脂的制备和研究进展[J]. 中国胶粘剂, 2009, 18(8): 42-46.
[3] 王冬梅, 赵献增. 有机硼改性酚醛树脂的合成[J]. 中国胶粘剂, 2006, 15(1): 15-20.
[4] 邱军, 王国建, 李岩, 等. 硼改性酚醛树脂的合成及其复合材料的性能[J]. 建筑材料学报, 2007, 10(2): 183-187.
[5] 许亚洪, 益小苏. 硼酚醛改性BMI树脂的研究[J]. 工程塑料应用, 2001, 29(4): 1-3.
[6] Eliton S M, Jose A M, Kuruvilla J, et al. Curing behavior of novolac-type phenolic resin analyzed by differential scanning calormetry [J]. Journal of Applied Polymer Science, 2003, 90(6): 1678-1682.
[7] Carotenuto G, Nicolais L. Kinetic study of phenolic resin cured by IR spectrospy [J]. Journal of Applied Polymer Science, 1999, 74(11): 2703-2715.
[8] Laza M, Vilas J L, Rodriguez M, et al. Analysis of the crosslinking process of a phenolic resin by themal scanning rheometry [J]. Journal of Applied Polymer Science, 2002, 83(1): 57-65.
[9] Vazquez G, Gonzlez-Alvarez J, López-Suevos F, et al. Curing kinetics of tannin-phenol-formaldehyde adhesives determined by DSC [J]. Journal of Thermal Analysis and Calorimetry, 2002, 70: 19-28.
[10] Alonso M V, Oliet M, Pérez J M, et al. Determination of curing kinetic parameters of lignin-phenol-formaldehyde resol resins by several dynamic differential scanning calorimetry methods [J]. Thermochimica Acta, 2004, 419(1/2): 161-167.
[11] Alonso M V, Oliet M, Garcia J, et al. Master curve and time-temperature-transformation cure diagram of lignin-phenolic and phenolic resol resins [J]. Journal of Applied Polymer Science, 2007, 103(5): 3362-3369.
[12] 徐寿昌. 有机化学 [M]. 2版. 北京: 高等教育出版社, 1993: 7.
[13] 季庆娟, 刘胜平. 酚醛树脂固化动力学研究[J]. 热固性树脂, 2006, 21(5): 10-12.
[14] 朱超, 李建, 许培俊, 等. 钡酚醛树脂的固化行为研究[J]. 石化技术与应用, 2007, 25(2): 124-126.
[15] 蒋海云, 王继刚, 段志超, 等. 硼改性酚醛树脂的高温结构演变特性[J]. 材料研究学报, 2006, 20(2): 203-207.
[16] Shinn-Shyong Tzeng, Ya-Ga Chr. Evolution of microstructure and properties of phenolic resin-based carbon/carbon composites during pyrolysis [J]. Materials Chemistry and Physics, 2002, 73(2/3): 162-169.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%