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以Sn-Zn合金为母合金,添加Ga元素,得到了新型的无铅焊料合金.测量了其熔点、硬度、剪切强度和可焊性等性能.研究发现,Ga元素的添加使焊料的熔点降低,熔程增大.焊料的硬度和剪切强度有所降低.焊料的铺展率增大,浸润角减小,提高了焊料的可焊性.通过实验研究确定了具有较好综合性能的焊料的成分范围.

参考文献

[1] Mulugeta Abtewa;Guna Selvaduray .Lead-free Solders in Microelectronics[J].Materials Science and Engineering,2000,27:95-141.
[2] Zeng K.;Tu KN. .Six cases of reliability study of Pb-free solder joints in electronic packaging technology [Review][J].Materials Science & Engineering, R. Reports: A Review Journal,2002(2):55-105.
[3] Kikuchi S;Nishimura M;Suetsugu K et al.Strength of Bonding Interface in Lead-Free Sn Alloy Solders[J].Materials Science and Engineering,2001,A319-321:475-479.
[4] 两种Sn-Ag焊料的机械疲劳断裂特征[J].稀有金属材料与工程,1999(04):259.
[5] F. A. Stam;E. Davitt .Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints[J].Microelectronics and reliability,2001(11):1815-1822.
[6] Peng W.Lead-Free Electronic Assembly Based on Sn-Ag-Cu Solders[M].Helsinki:Helsinki University of Technology Press,2001:143-150.
[7] 马鑫,董本霞.无铅钎料发展现状[J].电子工艺技术,2002(02):47-52.
[8] 南京电子学会.电子产品可焊性及焊接技术[M].北京:科学出版社
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