采用化学镀方法对平均粒度为3 μm的钼粉进行化学镀铜,温度和pH值分别控制在55～75℃和11.5～13.利用X射线衍射分析镀后粉末的相组成,用SEM观察未镀铜和镀铜粉末的形貌.结果表明,温度65℃、pH值12.5为化学镀铜的最佳工艺,此时,铜含量达到46%(质量分数,下同).提出了钼粉表面镀铜层生长的"扩散-缩小自催化"模型.
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