以混合磨料氧化铈和氧化硅、pH调节剂羟乙基乙二胺、表面活性剂聚乙烯吡咯烷酮为原料配制抛光液,通过对TFT-LCD玻璃基板进行超声波精细雾化化学机械抛光的正交试验研究,优化了抛光液的成分,并对传统抛光和雾化抛光进行了对比.结果表明:当氧化铈和氧化硅的质量分数分别为4%和10%、pH值为11、表面活性剂的质量分数为1.5%时,材料去除率MRR为215nm/min,表面粗糙度Ra为1.6nm.在相同的试验条件下,传统抛光的去除率和表面粗糙度分别为304nm/min和1.5nm;虽然雾化抛光去除率略低于传统抛光,但抛光液用量仅为传统的1/8.
参考文献
[1] | 扈海燕,杨泳欣.LCD和TFT-LCD用玻璃基片[J].玻璃,2003(05):20-21. |
[2] | 刘海燕.TFT-LCD用玻璃基板的性能及检测[J].玻璃,2009(01):22-24. |
[3] | 李超.TFT-LCD用玻璃基板发展现状及趋势[J].玻璃,2006(01):15-17,23. |
[4] | 田英良,张磊,戴琳,程金树.TFT-LCD基板玻璃化学组成的发展状况与展望[J].硅酸盐通报,2010(06):1348-1352,1362. |
[5] | 郭东明,康仁科,苏建修,金洙吉.超大规模集成电路制造中硅片平坦化技术的未来发展[J].机械工程学报,2003(10):100-105. |
[6] | 孙玉利,左敦稳,王宏宇,朱永伟,李军.表面活性剂对纳米CeO2在水介质中分散性能的影响[J].南京航空航天大学学报,2011(01):71-74. |
[7] | 胡志孟,雒建斌,李同生.纳米金刚石计算机磁头抛光液的研制及应用[J].材料科学与工程学报,2004(03):323-327. |
[8] | Liangyong Wang;Kailiang Zhang;Zhitang Song;Songlin Feng .Ceria concentration effect on chemical mechanical polishing of optical glass[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2007(11):4951-4954. |
[9] | Effect of abrasive particle concentration on preliminary chemical mechanical polishing of glass substrate[J].Microelectronic engineering,2010(11):2168-2172. |
[10] | MALIK F;HASAN M .Manufacturability of the CMP process[J].THIN SOLID FILMS,1995,270:612-615. |
[11] | Robert Sabia;Harrie J. Stevens;James R. Varner .Pitting of a glass-ceramic during polishing with cerium oxide[J].Journal of Non-Crystalline Solids: A Journal Devoted to Oxide, Halide, Chalcogenide and Metallic Glasses, Amorphous Semiconductors, Non-Crystalline Films, Glass-Ceramics and Glassy Composites,1999(2/3):123-130. |
[12] | Ekkard Brinksmeier;Oltmann Riemer;Alexander Gessenharter .Finishing of structured surfaces by abrasive polishing[J].Precision Engineering,2006(3):325-336. |
[13] | Tetsuya H;Yasushi K;Yuuki T et al.Mechanism of polishing of SiO2 films by CeO2 particles[J].JOURNAL OF NON-CRYSTALLINE SOLIDS,2001,283:129-134. |
[14] | C. J. Evans;E. Paul;D. Dornfeld;D. A. Lucca;G. Byrne;M. Tricard;F. Klocke;O. Dambon;B. A. Mullany .Material Removal Mechanisms in Lapping and Polishing[J].CIRP Annals,2003(2):611-633. |
[15] | V. Sinhoff .Generative precision grinding of optical glass[J].CIRP Annals,1998(1):253-258. |
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