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以硅树脂为基体材料,多层石墨为导热填料,采用旋转搅拌球磨法制备了多层石墨/硅树脂导热复合材料,研究了填料对多层石墨/硅树脂复合材料热导率、热膨胀系数(CTE)和热稳定性的影响.结果表明,多层石墨在硅树脂中分散性良好.多层石墨/硅树脂复合材料的热导率随多层石墨填充量的增加而增大,填充质量分数为45%时,热导率达到2.26W· (m· K)-1,超过此值之后热导率开始下降.随着填料的增加,多层石墨/硅树脂复合材料热膨胀系数减小.与纯硅树脂相比,多层石墨/硅树脂复合材料热稳定性高.相同填充量下多层石墨/硅树脂比SiC/硅树脂、AlN/硅树脂的热导率高得多,这说明径厚比大的片状填料更易形成有效接触和导热网链.

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