有效热导率是铝基复合材料在电子封装、热控方面应用的重要性能指标.结合复合材料广义自洽微观力学模型,并在Maxwell理论的基础上,初步建立了适合高体积分数SiCp/Al复合材料的有效热导率预测模型.模型不仅考虑了颗粒与颗粒、颗粒与基体间的界面效应,而且在一定程度上也考虑了增强体颗粒的形状.其理论计算结果与实测值吻合较好.
参考文献
| [1] | Occhionero Mark A;Hay Robert A;Adams Richard W.Aluminum silicon carbide(AlSiC) microprocessor lids and heat sinks for integrated thermal management solutions[A].,2000:55. |
| [2] | 刘正春,王志法,姜国圣.金属基电子封装材料进展[J].兵器材料科学与工程,2001(02):49-53. |
| [3] | 王莹,刘向东.碳化硅颗粒增强铝基复合材料的现状及发展趋势[J].铸造设备研究,2003(03):18-22. |
| [4] | 晓青.复合材料的广阔应用前景[J].金属世界,2003(06):27-29. |
| [5] | Lee Hyo S;Jeon Kyung Y et al.Fabrication process and thermal properties of SiCP/Al metal matrix composites for electronic packaging applications[J].Journal of Materials Science,2000,35:6231. |
| [6] | Ervin Vincet J;Klett James W;Mundt Chad M .Estimation of the thermal conductivity of composites[J].Journal of Materials Science,1999,34:3545. |
| [7] | Lord Rayleigh .On the influence of obstacles arranged in rectangular order upon the properties of a medium[J].Philosophical Magazine,1892,34:481. |
| [8] | Hasselman D P H;Donaldson Kimberly Y;Giger Alan L .Effect of reinforcement particle size on the thermal conductivity of particulate-silicon carbide-reinforced aluminun matrix composite[J].Journal of the American Ceramic Society,1992,75(11):3137. |
| [9] | Hasselman D P H;Johnson L F .Effective thermal conductivity of composites with interfacial thermal barrier resis-tance[J].Journal of Composite Materials,1987,21(06):508. |
| [10] | 田莳.材料物理性能[M].北京:北京航空航天大学出版社,2001:244. |
| [11] | Hashin Z .Analysis of composite materials-A survey[J].Journal of Applied Mechanics,Transactions of the ASME,1983,50:481. |
| [12] | 姜任秋.热传导、质扩散与动量传递中的瞬态冲击效应[M].北京:科学出版社,1997:56. |
| [13] | 张强 .高体积分数铝基复合材料的微观组织与性能研究[D].哈尔滨工业大学,2003. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%