水分对印制电路板的可靠性有重要影响.电路板中的水分子可以改变电路基板的热性能及热力学性能,从而影响电路板及元器件的正常功能.研究了吸湿对两种无卤PCB及两种含卤PCB层压板热膨胀系数的影响,评价了IPC-TM-650 2.4.24测试方法中预处理方法对吸湿样品的适用性.结果表明,PCB层压板中的水分对PCB层压板的热膨胀曲线有明显影响,但传统的热膨胀系数计算方法并不能显示这种影响,对此作了详细分析并提出了改进建议.同时,IPC测试方法中的预处理可以降低湿度对样品热膨胀曲线的影响,但不能完全消除.
参考文献
| [1] | Liu P C;Wang D W;Livingston E D et al.Moisture absorption behavior of printed circuit laminate materials[J].Adv in Electronic Packaging,1993,4:435. |
| [2] | Rudra B.;Pecht M.;Jennings D. .Assessing time-to-failure due to conductive filament formation inmulti-layer organic laminates[J].IEEE transactions on components, packaging, and manufacturing technology.Part B.Advanced packaging,1994(3):269-276. |
| [3] | Michael G. Pecht;Haleh Ardebili;Anand A. Shukla;John K. Hagge;David Jennings .Moisture ingress into organic laminates[J].IEEE transactions on components and packaging technologies: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,1999(1):104-110. |
| [4] | E.H. Wong;R. Rajoo .Moisture absorption and diffusion characterisation of packaging materials-advanced treatment[J].Microelectronics and reliability,2003(12):2087-2096. |
| [5] | Akay M;Mun S K A;Stanley A .Influence of moisture on the thermal and mechanical properties of autoclaved and oven-cured kevlar-49/epoxy laminates[J].Composites Science and Technology,1997,57:565. |
| [6] | Lundgren J;Oudmundson P .Moisture absorption in glassfiber/epoxy laminates with transverse matrix cracks[J].Composites Science and Technology,1999,59:1983. |
| [7] | Demaree R.Halogen-free systems in current PCB practice[M].IPC EXPO.USA,2001 |
| [8] | Wong E H;Rajoo R.Trends and challenges of environmentally friendly laminates[J].Primed Circuit Fabrication,2003(03):26. |
| [9] | Sanapala R;Sood B;Das D et al.Effect of lead-free soldering on key material properties of FR-4 printed circuit board laminates[J].IEEE Transactions on Electronics Packaging Manufacturing,2009,32(04):272. |
| [10] | IPC-TM-650 2.4.24.Glass transition temperature and z-axis thermal expansion by TMA[S].The Institute for Interconnecting and Packaging Electronic Circuits,Northbrook,IL,1994. |
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