采用两步球磨法和放电等离子烧结(SPS)技术制备出超细晶Cu/Al2O3块体复合材料.采用X射线衍射仪,差示扫描量热仪,电子探针,扫描电子显微镜等对复合材料的组织结构进行表征和分析,并对球磨过程中的自蔓延高温合成进行分析.结果表明,Cu和CuO在第一次球磨过程中发生反应获得了混合均匀的Cu/Cu2O复合粉末;第二次球磨使部分的Al固溶到Cu中,且使整个粉末中的Cu2O和Al发生自蔓延高温合成反应,制备出均匀松散的Cu/Al2O3复合粉末.经过SPS烧结得到超细晶Al2O3颗粒增强Cu基复合块体材料,Al2O3颗粒大小为150 nm左右,块体的显微硬度达到220 HV.
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