采用电沉积的方法制备了CuCoNi三元颗粒膜,并测量其GMR和磁性能.研究发现添加适量的Ni有利于膜层中磁性颗粒的析出,添加过多的Ni反而降低膜层中磁性粒子的浓度.制备态样品中存在超顺磁性粒子,此时饱和磁化强度比未添加Ni高,而矫顽力低.真空退火处理使超顺磁性粒子转变为铁磁性粒子,提高了矫顽力.450℃处理膜层达到最佳结构,具有GMR最大值,更高退火温度会使膜层中形成三元合金相,降低了GMR效应.
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