研究了一种铜包铝线浸锌后的无氰预镀铜工艺.最佳镀液配方为:20～25 g/L焦磷酸铜,320～350 g/L焦磷酸钾,40～45 g/L辅助配位剂A(氨羧化合物),15～20 g/t辅助配位剂B(有机酸).讨论了起始电流密度、温度、预镀时间及pH对镀层结合强度的影响,得出最佳工艺参数为:起始电流密度0.3～1.1 A/dm~2,温度25～40℃,预镀时间3 min,pH 8.0～8.8.
A non-cyanide pre-copper plating process on copper-clad aluminum wire after zinc dipping was studied. The optimal bath composition is as follows: copper pyro-phosphate 20-25 g/L, potassium pyrophosphate 320-350 g/L, as well as auxiliary complexing agents A (an amino carboxylic compound) 40-45 g/L and B (an organic acid) 15-20 g/L. The effects of technological parameters on the bonding strength of coatings were discussed. The optimal parameters are as follows: temperature 25-40℃, pH 8.0-8.8, initial current density 0.3-1.1 A/dm~2, and time 3 min.
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