采用电化学线性极化、交流阻抗谱技术研究了不同基片偏压上阴极电弧沉积TiN/Ti镀层在50×10-6g/g Cl-溶液中的腐蚀行为,并对镀层腐蚀的机理进行了探讨.结果表明:基片偏压-400V时,镀层耐蚀性能好;镀层表面的针孔是诱发镀层和基材体系发生点蚀、电偶腐蚀的主要缺陷.
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