12～28 mA/cm2范围内,采用AlCl3-EMIC(氯化1-甲基-3-乙基咪唑)熔盐电沉积法在18～40 ℃获得铝镀层,用X射线衍射(XRD)仪和扫描电子显微镜(SEM)研究其织构与形貌.结果表明,铝镀层呈(200)晶面择优取向,其相对衍射峰强度随电流密度和沉积温度升高而减弱,随镀层厚度增加而增强.厚度为8 μm时镀层择优取向最明显,其表面颗粒呈棱锥状均匀紧密排列.电流密度为12 mA/cm2时,随温度升高镀层由(200)晶面择优取向转变为(200)和(222)晶面择优取向,其表面颗粒随之由较均匀的棱锥状转变为不规则的核桃仁状.讨论镀层织构形成的可能机制.
参考文献
| [1] | Wang D Q;Shi Z Y .[J].App Surf Scic,2004,227(1/4):255. |
| [2] | Dumitrescu L;Maury F .[J].Surface and Coatings Technology,2000,125(1/3):419. |
| [3] | Zhang S M;Zhou Y Q .[J].J NanKai Uni,1999,32(04):63. |
| [4] | 李庆峰,邱竹贤,N.J.Bjerrum.铝在NaCl-AlCl3熔盐体系中的电化学沉积[J].稀有金属材料与工程,1995(03):59-63. |
| [5] | Lai K;Kazacos M .[J].Journal of Electroanalytical Chemistry,1988,248:431. |
| [6] | Jiang T;Brym MJC;Dube G;Lasia A;Brisard GM .Electrodeposition of aluminium from ionic liquids: Part I - electrodeposition and surface morphology of aluminium from aluminium chloride (AlCl3)-l-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquids[J].Surface & Coatings Technology,2006(1/2):1-9. |
| [7] | Lee J-J.;Miller B. .Aluminum Deposition and Nucleation on Nitrogen-Incorporated Tetrahedral Amorphous Carbon Electrodes in Ambient Temperature Chloroaluminate Melts[J].Journal of the Electrochemical Society,2000(9):3370-3376. |
| [8] | Carlin R T;Crawford W;Bersh M .[J].Journal of the Electrochemical Society,1992,139(10):2720. |
| [9] | Qin Q;Skyllas K X M .[J].Journal of Electroanalytical Chemistry,1984,168:193. |
| [10] | Lai P K;Skyllas-Kazacos M .[J].Electrochimica Acta,1987,32(10):1443. |
| [11] | Robinson J;Osteryoung R A .[J].Journal of the Electrochemical Society,1980,127(01):123. |
| [12] | 韩文生,谢锐兵,萧以德.钕铁硼稀土永磁材料室温熔盐电镀铝的研究[J].材料保护,2005(10):1-4. |
| [13] | 逢清强.Electroplating of Mild Steel by Aluminium from Low Temperature Molten Salt System n-Butyl Pyridinium Chloride(钢铁室温熔盐电镀铝的研究)[M].杭州:浙江大学,2000 |
| [14] | Chang J K;Chen S Y;Wen Ta Tsai et al.[J].Journal of the Electrochemical Society,2008,155(03):C112. |
| [15] | Liu QX;El Abedin SZ;Endres F .Electroplating of mild steel by aluminium in a first generation ionic liquid: A green alternative to commercial Al-plating in organic solvents[J].Surface & Coatings Technology,2006(3/4):1352-1356. |
| [16] | Pangarov N A .[J].Journal of Electroanalytical Chemistry,1965,9:70. |
| [17] | Qing L;William R P;Gemma Stewart et al.[J].Journal of the Electrochemical Society,1997,144(03):936. |
| [18] | Yue G K;Lu X M;Zhu Y L et al.[J].Chemical Engineering Journal,2009,147:79. |
| [19] | 皋敏;杨防祖;黄令 et al.[J].Acta Phys Chim Sin(物理化学学报),2002,18(11):973. |
| [20] | 朱立群.Electrodepositing Theory and Its Technology of Function Films (功能膜层的电沉积理论与技术)[M].Beijing:Press of Beihang University,2005:110. |
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