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综述了化学镀镍预处理的一般工艺,介绍了铜及铜合金,石墨及其粉末,塑料,陶瓷,玻璃,石英,PCB等基体材料化学镀镍前表面预处理工艺的研究现状,并展望了今后的发展方向.

参考文献

[1] 李宁;屠振密.化学镀实用技术[M].北京:化学工业出版社,2004:57-64.
[2] 张朝阳,魏锡文.化学镀镍活化或诱发方法[J].表面技术,2002(06):62-64,72.
[3] 郭忠诚;杨显万.化学镀镍原理及应用[M].昆明:云南科学技术出版社,1998:12-13.
[4] 李兵,唐作琴,魏锡文,胡登莉.黄铜基体上化学镀镍的研究[J].表面技术,2000(05):7-8.
[5] 杨超,甘复兴,沈伟.恒电位极化诱发钨铜合金化学镀镍磷的研究[J].材料保护,2006(05):4-6.
[6] 徐桂英;王雪英 .石墨化学镀Ni-P合金工艺的研究[J].表面技术,1992,21(05):226-231.
[7] 屈战民.石墨粉末化学镀镍工艺研究[J].电镀与涂饰,2005(02):21-23,31.
[8] 屈战民.用于电磁屏蔽与吸收材料的镀镍石墨粉的研究[J].电镀与环保,2007(04):29-31.
[9] Palaniappa M;Babu GV;Balasubramanian K .Electroless nickel-phosphorus plating on graphite powder[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2007(1-2):165-168.
[10] Pochner K;Beil S;Horn H;Blomer M .Treatment of polymers for subsequent metallization using intense UV radiation or plasma at atmospheric pressure[J].Surface & Coatings Technology,1997(1/3):372-377.
[11] Hilmar Esrom;Robert Seebock;Marlene Charbonnier;Maurice Romand .Surface activation of polyimide with dielectric barrier discharge for electroless metal deposition[J].Surface & Coatings Technology,2000(1/3):19-24.
[12] Xuejiao Tang;Meng Cao;Chengliang Bi;Lijuan Yan;Baogui Zhang .Research on a new surface activation process for electroless plating on ABS plastic[J].Materials Letters,2008(6/7):1089-1091.
[13] Lee CK .Corrosion and wear-corrosion resistance properties of electroless Ni-P coatings on GFRP composite in wind turbine blades[J].Surface & Coatings Technology,2008(19):4868-4874.
[14] 郭伟荣,曾鑫,项昕.ABS塑料胶体钯-化学镍电镀前处理工艺[J].材料保护,2003(07):48-49.
[15] 李瑞海,顾宜.聚苯乙烯塑料表面化学镀镍的研究[J].四川大学学报(工程科学版),2004(06):62-65.
[16] 杨世莹,贺子凯,黄鑫.ABS化学镀镍前处理工艺的改进[J].电镀与涂饰,2006(04):16-18.
[17] 刘峥,肖顺华,林原斌.ABS塑料表面化学镀镍无钯活化工艺研究[J].材料保护,2006(11):29-31.
[18] 杨一兵,黎炜,徐艳,廖蔚峰.ABS塑料化学镀镍工艺[J].电镀与涂饰,2006(10):14-15.
[19] 高亚娟,靳玲,李立燕,李丽,李瑞海.聚丙烯酸酯作为塑料化学镀镍预处理剂的研究[J].塑料科技,2006(04):70-75.
[20] 姜晓霞;沈伟.化学镀理论与实践[M].北京:国防工业出版社,2000:335.
[21] MACAULEY D J;KELLY P V;MONGEY K F et al.Atmospheric pressure excimer lamp-assisted photoselective activation process for electroless plating[J].Applied Surface Science,1999,138/139:622-626.
[22] Goossens O.;Vangeneugden D.;Van de Leest R.;Leys C.;Dekempeneer E. .Application of atmospheric pressure dielectric barrier discharges in deposition, cleaning and activation[J].Surface & Coatings Technology,2001(0):474-481.
[23] 胡光辉 .化学镀镍中添加剂作用和活化过程的机理研究[D].厦门大学,2004.
[24] KANOH O;YOSHIDA Y;OGISO Y .Activating catalytic solution for electroless plating and method for electroless plating[P].US,5989787,1999-11-23.
[25] Tetsuya Osaka;Nao Takano;Tetsuya Kurokawa .Fabrication of Electroless NiReP Barrier Layer on SiO_2 Without Sputtered Seed Layer[J].Electrochemical and solid-state letters,2002(1):C7-C10.
[26] T.N. Khoperia .Investigation of the substrate activation mechanism and electroless Ni―P coating ductility and adhesion[J].Microelectronic engineering,2003(2/4):391-398.
[27] Zhang QY;Wu M;Zhao W .Electroless nickel plating on hollow glass microspheres[J].Surface & Coatings Technology,2005(2/3):213-219.
[28] Zhen-guo An;Jing-jie Zhang;Shun-long Pan .Fabrication Of Glass/ni-fe-p Ternary Alloy Core/shell Composite Hollow Microspheres Through A Modified Electroless Plating Process[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2008(5P1):2219-2224.
[29] 傅圣利,李义和,王本根,陈占营.玻璃表面无钯活化化学镀镍的研究[J].电镀与精饰,2000(05):10-13.
[30] 沈伟;彭德全;沈晓丹.M203陶瓷表面金属化[A].,2002:14-20.
[31] 王森林,吴辉煌.玻璃表面的无钯活化化学镀镍[J].应用化学,2003(05):491-492.
[32] 赵芳霞,张振忠,郭世德.石英玻璃表面化学镀镍-磷工艺研究[J].功能材料,2007(02):268-271,275.
[33] 郑衡,邵谦,冷树伟,葛圣松.空心玻璃微珠表面无钯活化化学镀镍[J].表面技术,2008(01):56-58.
[34] LI L B;AN M Z .Electroless nickel-phosphoras plating on SiCp/Alcomposite from acid bath with nickel activation[J].Journal of Alloys and Compounds,2008,461(1,2):85-91.
[35] 蔡积庆 .印制板化学镀镍[J].表面技术,1994,23(01):31-33.
[36] 陈智栋,何万强,林西平.锌溶液催化印制板铜箔化学镀镍[J].电镀与涂饰,2005(12):22-24.
[37] 王振辉,王正波.陶瓷覆铜板化学镀镍工艺[J].电镀与环保,2005(03):22-23.
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