综述了化学镀镍预处理的一般工艺,介绍了铜及铜合金,石墨及其粉末,塑料,陶瓷,玻璃,石英,PCB等基体材料化学镀镍前表面预处理工艺的研究现状,并展望了今后的发展方向.
参考文献
[1] | 李宁;屠振密.化学镀实用技术[M].北京:化学工业出版社,2004:57-64. |
[2] | 张朝阳,魏锡文.化学镀镍活化或诱发方法[J].表面技术,2002(06):62-64,72. |
[3] | 郭忠诚;杨显万.化学镀镍原理及应用[M].昆明:云南科学技术出版社,1998:12-13. |
[4] | 李兵,唐作琴,魏锡文,胡登莉.黄铜基体上化学镀镍的研究[J].表面技术,2000(05):7-8. |
[5] | 杨超,甘复兴,沈伟.恒电位极化诱发钨铜合金化学镀镍磷的研究[J].材料保护,2006(05):4-6. |
[6] | 徐桂英;王雪英 .石墨化学镀Ni-P合金工艺的研究[J].表面技术,1992,21(05):226-231. |
[7] | 屈战民.石墨粉末化学镀镍工艺研究[J].电镀与涂饰,2005(02):21-23,31. |
[8] | 屈战民.用于电磁屏蔽与吸收材料的镀镍石墨粉的研究[J].电镀与环保,2007(04):29-31. |
[9] | Palaniappa M;Babu GV;Balasubramanian K .Electroless nickel-phosphorus plating on graphite powder[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2007(1-2):165-168. |
[10] | Pochner K;Beil S;Horn H;Blomer M .Treatment of polymers for subsequent metallization using intense UV radiation or plasma at atmospheric pressure[J].Surface & Coatings Technology,1997(1/3):372-377. |
[11] | Hilmar Esrom;Robert Seebock;Marlene Charbonnier;Maurice Romand .Surface activation of polyimide with dielectric barrier discharge for electroless metal deposition[J].Surface & Coatings Technology,2000(1/3):19-24. |
[12] | Xuejiao Tang;Meng Cao;Chengliang Bi;Lijuan Yan;Baogui Zhang .Research on a new surface activation process for electroless plating on ABS plastic[J].Materials Letters,2008(6/7):1089-1091. |
[13] | Lee CK .Corrosion and wear-corrosion resistance properties of electroless Ni-P coatings on GFRP composite in wind turbine blades[J].Surface & Coatings Technology,2008(19):4868-4874. |
[14] | 郭伟荣,曾鑫,项昕.ABS塑料胶体钯-化学镍电镀前处理工艺[J].材料保护,2003(07):48-49. |
[15] | 李瑞海,顾宜.聚苯乙烯塑料表面化学镀镍的研究[J].四川大学学报(工程科学版),2004(06):62-65. |
[16] | 杨世莹,贺子凯,黄鑫.ABS化学镀镍前处理工艺的改进[J].电镀与涂饰,2006(04):16-18. |
[17] | 刘峥,肖顺华,林原斌.ABS塑料表面化学镀镍无钯活化工艺研究[J].材料保护,2006(11):29-31. |
[18] | 杨一兵,黎炜,徐艳,廖蔚峰.ABS塑料化学镀镍工艺[J].电镀与涂饰,2006(10):14-15. |
[19] | 高亚娟,靳玲,李立燕,李丽,李瑞海.聚丙烯酸酯作为塑料化学镀镍预处理剂的研究[J].塑料科技,2006(04):70-75. |
[20] | 姜晓霞;沈伟.化学镀理论与实践[M].北京:国防工业出版社,2000:335. |
[21] | MACAULEY D J;KELLY P V;MONGEY K F et al.Atmospheric pressure excimer lamp-assisted photoselective activation process for electroless plating[J].Applied Surface Science,1999,138/139:622-626. |
[22] | Goossens O.;Vangeneugden D.;Van de Leest R.;Leys C.;Dekempeneer E. .Application of atmospheric pressure dielectric barrier discharges in deposition, cleaning and activation[J].Surface & Coatings Technology,2001(0):474-481. |
[23] | 胡光辉 .化学镀镍中添加剂作用和活化过程的机理研究[D].厦门大学,2004. |
[24] | KANOH O;YOSHIDA Y;OGISO Y .Activating catalytic solution for electroless plating and method for electroless plating[P].US,5989787,1999-11-23. |
[25] | Tetsuya Osaka;Nao Takano;Tetsuya Kurokawa .Fabrication of Electroless NiReP Barrier Layer on SiO_2 Without Sputtered Seed Layer[J].Electrochemical and solid-state letters,2002(1):C7-C10. |
[26] | T.N. Khoperia .Investigation of the substrate activation mechanism and electroless Ni―P coating ductility and adhesion[J].Microelectronic engineering,2003(2/4):391-398. |
[27] | Zhang QY;Wu M;Zhao W .Electroless nickel plating on hollow glass microspheres[J].Surface & Coatings Technology,2005(2/3):213-219. |
[28] | Zhen-guo An;Jing-jie Zhang;Shun-long Pan .Fabrication Of Glass/ni-fe-p Ternary Alloy Core/shell Composite Hollow Microspheres Through A Modified Electroless Plating Process[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2008(5P1):2219-2224. |
[29] | 傅圣利,李义和,王本根,陈占营.玻璃表面无钯活化化学镀镍的研究[J].电镀与精饰,2000(05):10-13. |
[30] | 沈伟;彭德全;沈晓丹.M203陶瓷表面金属化[A].,2002:14-20. |
[31] | 王森林,吴辉煌.玻璃表面的无钯活化化学镀镍[J].应用化学,2003(05):491-492. |
[32] | 赵芳霞,张振忠,郭世德.石英玻璃表面化学镀镍-磷工艺研究[J].功能材料,2007(02):268-271,275. |
[33] | 郑衡,邵谦,冷树伟,葛圣松.空心玻璃微珠表面无钯活化化学镀镍[J].表面技术,2008(01):56-58. |
[34] | LI L B;AN M Z .Electroless nickel-phosphoras plating on SiCp/Alcomposite from acid bath with nickel activation[J].Journal of Alloys and Compounds,2008,461(1,2):85-91. |
[35] | 蔡积庆 .印制板化学镀镍[J].表面技术,1994,23(01):31-33. |
[36] | 陈智栋,何万强,林西平.锌溶液催化印制板铜箔化学镀镍[J].电镀与涂饰,2005(12):22-24. |
[37] | 王振辉,王正波.陶瓷覆铜板化学镀镍工艺[J].电镀与环保,2005(03):22-23. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%