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综述了目前SiC颗粒、碳纤维和SCS-6 SiC连续纤维增强铜基复合材料的研究现状,介绍了其制备技术及存在的问题,并指出了今后的研究重点和发展方向.

参考文献

[1] 董仕节;史耀武.铜基复合材料的研究进展[J].国外金属热处理,1999(06):9.
[2] Dadras M M;Morris D G .Examination of some high strength,high-conductivity copper alloys for high-temperature applications[J].Scripta Materialia,1994,38(02):199.
[3] 杨贵荣,郝远,宋文明,阎峰云.高性能铜材的研究近况[J].铸造技术,2003(01):13-15.
[4] Ellis T W et al.[J].Metallurgical and Materials Transactions,1993,24A:21.
[5] 田素贵,张禄廷,王桂华,乔瑞庆,金寿日,李铁藩.AlN颗粒增强Cu基复合材料内氧化的研究[J].材料工程,2000(10):25-28.
[6] 熊拥军,邓至谦,凌兴珠,江玲,敖晖.TiB2颗粒增强铜基复合材料的研究[J].中南工业大学学报(自然科学版),2001(03):294-297.
[7] 由臣;毕大森;陈民芳.WC/Cu复合材料的研究[J].河北冶金,2000(03):16.
[8] 董树荣,涂江平,张孝彬.纳米碳管增强铜基复合材料的力学性能和物理性能[J].材料研究学报,2000(z1):132-136.
[9] 董树荣,张孝彬.米碳管增强铜基复合材料的滑动磨损特性研究[J].摩擦学学报,1999(01):1-6.
[10] 崔春翔,赵晓宏,徐华,张红娣.碳纤维-铜复合材料研究[J].河北工业大学学报,2002(06):43-48.
[11] 凤仪.热压工艺对碳纤维-铜复合材料横向断裂强度影响[J].热加工工艺,1997(04):12.
[12] 刘德宝,崔春翔.高强度高导电铜基复合材料制备技术回顾与展望[J].天津理工学院学报,2003(04):29-33.
[13] Korb G;Kora'b J;Groboth G .Thermal expansion behavior of unidirectional carbon-fibre-reinforced copper-matrix composites[J].Composites Part A:Applied Science and Manufacturing,1998,29A:1563.
[14] Xu Jincheng;Yu Hui et al.Effects of some factors on the tribological properties of the short carbon fiber-reinforced copper composite[J].Materials & Design,2004,25:489.
[15] Koráb J;(S)tefánik P;Kavecky (S) et al.Thermal expansion of cross-ply and woven carbon fibre-copper matrix composites[J].Computer Part A,2002,33:133.
[16] 王玉林;万怡灶;成国祥 等.界面结合强度对C/Cu复合材料热膨胀性能的影响[J].复合材料学报,1998,15(01):83.
[17] Brendel A;Popescu C;Leyens C;Woltersdorf J;Pippel E;Bolt H .SiC-fibre reinforced copper as heat sink material for fusion applications[J].Journal of Nuclear Materials: Materials Aspects of Fission and Fusion,2004(0):804-808.
[18] Brendel, A;Popescu, C;Schurmann, H;Bolt, H .Interface modification of SiC-fibre/copper matrix composites by applying a titanium interlayer[J].Surface & Coatings Technology,2005(1/4):161-164.
[19] Brendel A;Woltersdorf J;Pippel E;Bolt H .Titanium as coupling agent in SiC fibre reinforced copper matrix composites[J].Materials Chemistry and Physics,2005(1):116-123.
[20] 朱建华,刘磊,胡国华,沈彬,胡文彬,丁文江.复合电铸制备Cu/SiCp复合材料[J].中国有色金属学报,2004(01):84-87.
[21] 赵乃勤.复合电沉积法制备SiCp/Cu复合材料的工艺研究[J].材料工程,1995(10):23.
[22] Rado C;Drevet B;Eustathopoulws N .The role of conpound formatlon im reactlcre wetting:the Cu/SiC system[J].Acta Materiae Compositae Sinica,2000,48:4483.
[23] Tjong S C;Lau K C .Tribological behaviour of SiC particlereinforced copper matrix composites[J].Materials Letters,2000,43(5-6):274.
[24] Joshua Pelleg;Ruhr M;Ganor M .Control of the reaction at the fibre-matrix interface in a Cu/SiC metal matrix composite by modifying the matrix with 2.5 wt% Fe[J].Materials Science and Engineering,1996,A212:139.
[25] Kuen-Ming Shu;G.C. Tu .The microstructure and the thermal expansion characteristics of Cu/SiC_p composites[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):236-247.
[26] Yongzhong Zhan;Guoding Zhang .The effect of interfacial modifying on the mechanical and wear properties of SiC_p/Cu composites[J].Materials Letters,2003(29):4583-4591.
[27] Wan Y Z;Wang Y L et al.Effects of fiber volume frac tion,hot pressing parameters and alloying elements on tensile strength of carbon fiber reinforced copper matrix composite prepared by continuous three-step electrodeposition[J].Materials Science and Engineering,2000,A288:26.
[28] 陶宁,查正根,张良,凤仪.碳纤维表面电镀铜的研究[J].表面技术,2001(04):1-2,5.
[29] Schrank C;Eisenmenger-Sittner C et al.Solid state dewetting observed for vapor deposited copper films on carbon substrates[J].Thin Solid Films,2004,495:276.
[30] Eisenmenger-Sittner C;Neubauer E;Schrank C;Brenner J;Tomastik C .Solid state de-wetting of vapor deposited films on planar and fiber-shaped carbon substrates[J].Surface & Coatings Technology,2004(0):413-420.
[31] Schwarz B;Schrank C.Molybdenum interlayers as adhesion promotors for thin copper films on plasma treated glassy carbon[J].Surface and Coatings Technology
[32] Simon Dorfman;David Fuks .Carbon diffusion in copperbased metal matrix comosites[J].Sensors and Actuators A-physical,1995,51(01):13.
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