碳化硅(SiC)是第三代宽禁带半导体材料,在高温、高频、高功率、光电子及抗辐射等方面具有巨大的应用潜力.以CH4、SiH4为反应气体,H2为载气,采用化学气相沉积法,利用气-液-固(VLS)生长机理,同质外延6H-SiC薄膜.结果表明,VLS机制能在外延薄膜的表面有效地封闭微管,但是由于n(C)/n(Si)较大,薄膜表面存在大量的台阶.为了进一步改善薄膜表面形貌,采用"两步法"工艺外延SiC薄膜,在封闭微管的同时提高了表面平整度,得到了质量较好的6H-SiC外延薄膜.
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