采用乙烯基硅树脂与含氢硅油、四甲基四乙烯基环四硅氧烷在铂金催化剂的条件下进行加成反应，制得无色透明的有机硅电子绝缘灌封胶，并对有机硅灌封胶的各项性能进行测试和分析。结果表明：有机硅灌封胶的硬度可调，力学性能优异，透光率高达95%，具有很好的耐热性，在400℃时质量损失仅为0.5%，可作为透光率要求高的电子元器件的灌封材料。
A transparent pouring sealant was prepared by addition reaction from vinyl silicone resin, hydrogen-containing silicone liquid, and tetravinyl tetramethylcyelo tetrasiloxane under Pt catalyst, and its properties were tested and analyzed. The results show that the hardness of the silicone pouring sealant can be adjusted, and the transmittance is up to 95%. The silicone pouring sealant has excellent mechani-cal properties and thermal stability, and its mass loss is only 0.5% at 400℃, which can be used as a high transmittance pouring sealant for electronic component.
参考文献
| [1] | 王文,夏宇.导热绝缘材料的研究与应用[J].绝缘材料,2012(01):19-24. |
| [2] | 章文捷,马静.绝缘导热有机硅灌封材料的研制与应用[J].电子工艺技术,2004(01):30-32. |
| [3] | Gong S;Todd M;Loctite H.Effects of Flexibilizer on the Properties of Liquid Microelectronic Encapsulation Materials[A].,2002:239-244. |
| [4] | 高卫国,郭强,张艳飞,张建.有机硅在环氧包封料、灌封料中的应用[J].绝缘材料,2009(02):26-28,32. |
| [5] | 史玉莲,胡仰栋.电子工业用加成型硅橡胶型灌封胶的研究进展[J].现代化工,2004(z1):93-95,97. |
| [6] | 戚云霞,赵士贵,姜伟峰,陈国文.加成型室温硫化硅橡胶的研究进展[J].有机硅材料,2006(01):34-37. |
| [7] | 吴敏娟,周玲娟,江国栋,王庭慰.导热电子灌封硅橡胶的研究进展[J].有机硅材料,2006(02):81-85. |
| [8] | Feng Shengyu;Jiang Ping;Yu Shuqi et al.Effects of Some Phenylethynylsilicon Compounds on Heat-curable Silicone Rubber-IV:Tetraphenylethynylsilane[J].European Polymer Jour-nal,1995,31(03):309-311. |
| [9] | 王芳,青双桂,罗仲宽,李瑞菲,施勇.大功率LED封装材料的研究进展[J].材料导报,2010(03):56-59. |
| [10] | 李娟,黄旭,宋丽贤,卢忠远,康明,黄渝鸿.铂催化加成型有机硅灌封胶的制备及性能[J].绝缘材料,2012(01):5-7. |
| [11] | 吴启保,青双桂,熊陶,王芳,吕维忠,罗仲宽.封装用有机硅材料的制备及性能研究[J].广东化工,2009(02):23-25. |
| [12] | 魏朋 .加成型室温硫化硅橡胶的制备及改性研究[D].武汉理工大学,2007. |
| [13] | 葛建芳,卢凤纪.铂催化含氢硅氧烷脱氢及其对硫化硅橡胶电气性能的影响[J].绝缘材料,2002(01):26-28. |
| [14] | 赵翠峰,方仕江,罗嘉亮,詹学贵,邵月刚.加成型室温硫化硅橡胶的制备--Ⅰ.交联剂及填料的影响规律[J].浙江大学学报（工学版）,2007(07):1219-1222. |
| [15] | 黄世强;孙争光;李盛彪.新型有机硅高分子材料[M].北京:化学工业出版社,2004:170-178. |
| [16] | Hongbo Zhang;Jinyan Wang;Linke Li;Yuan Song;Mingshan Zhao;Xigao Jian .Synthesis Of Liquid Polysilisiquioxane Resins And Properties Of Cured Films[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2008(2):857-862. |
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