镍铬合金薄膜是重要的精密电阻和应变电阻薄膜材料.简述了镍铬合金薄膜的3种制备方法:真空蒸发沉积、磁控溅射沉积和离子束沉积;讨论了基底、工作气压、沉积时间等薄膜制备工艺参数以及退火工艺对薄膜性能的影响.重点叙述了镍铬合金薄膜、改良型镍铬合金膜、含氮镍铬合金膜、镍铬合金多层膜和纳米镍铬合金薄膜等膜系的特征.阐明了制备具有高电阻率、低电阻温度系数、高应变灵敏系数、良好的热稳定性等优异综合性能的镍铬合金薄膜的新工艺发展趋势.
参考文献
| [1] | 尹福炎.应变电阻材料的最新进展[J].金属材料研究,1994(03):23. |
| [2] | 尹炎福.电阻应变计技术六十年(2)电阻应变计敏感材料的发展[J].传感器世界,1998(09):9. |
| [3] | 尹炎福.电阻应变计技术六十年(2)电阻应变计敏感材料的发展(下)[J].传感器世界,1998(10):1. |
| [4] | 王学华,薛亦渝.薄膜制备新技术及其应用研究[J].真空电子技术,2003(05):65-70. |
| [5] | 唐伟忠.薄膜材料制备原理,技术及应用[M].北京:冶金工业出版社,1999:24. |
| [6] | 刘金声.离子束沉积薄膜技术及应用[M].北京:国防工业出版社,2003:344. |
| [7] | Arnell R D;Kelly P J .Recent advances in magnetron sputtering[J].Surface and Coatings Technology,1999,112:170. |
| [8] | Kukla R .Magnetron sputtering on large scale substrates: an overview on the state of the art[J].Surface and Coatings Technology,1997,93:1. |
| [9] | Ensinger W .Low energy ion assistant during deposition-an effective tool for controlling thin film microstructure[J].Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms,1997,127-128:796. |
| [10] | 朱瑞廉.混合微电路技术手册--材料、工艺、设计试验和生产[M].北京:电子工业出版社,2004:52. |
| [11] | 曲喜新 .现代电阻薄膜[J].电子元件与材料,1995,14(04):1. |
| [12] | Garcia-alonso A;Garcia J;Castano E et al.Strain sensitivity and temperature influence on sputtered thin films for piezoresistive sensors[J].Sensors and Actuators A-physical,1993,37-38(6-8):784. |
| [13] | Kazi Imam H;Wild P M;Moore T N et al.The electromechanical behavior of nichrome (80/20 wt%) film[J].Thin Solid Films,2003,433:337. |
| [14] | Horia Chiriac;Maria Urse;Florin Rusu et al.Ni-Ag thin films as strain-sensitive material for piezoresistive sensors[J].Sensors and Actuators A:Physical,1999,76(1-3):376. |
| [15] | Rajanna K.;Nayak MM. .Strain sensitivity and temperature behavior of Invar alloy films[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2000(3):288-292. |
| [16] | Schippel E .The influence of silicon on properties of deposited Ni-Cr films[J].Thin Solid Films,1986,144(02):21. |
| [17] | J. Musil;I. Leipner;M. Kolega .Nanocrystalline and nanocomposite CrCu and CrCu-N films prepared by magnetron sputtering[J].Surface & Coatings Technology,1999(1):32-37. |
| [18] | Musil J;Vlcek J .Magnetron sputtering of alloy and alloybased films[J].Thin Solid Films,1999,343-344(1/2):47. |
| [19] | Musil J.;Vlcek J. .Magnetron sputtering of films with controlled texture and grain size[J].Materials Chemistry and Physics,1998(1/3):116-122. |
| [20] | J. Musil;F. Regent .Formation of nanocrystalline NiCr-N films by reactive dc magnetron sputtering[J].Journal of Vacuum Science & Technology, A. Vacuum, Surfaces, and Films,1998(6):3301-3304. |
| [21] | Sato Y.;Sato S.;Watanabe M. .Electrical properties of Ni-Cr-N thin films deposited by multitarget reactive sputtering[J].Japanese journal of applied physics,2001(8):5091-5094. |
| [22] | 许光跃,路新春,常香荣,赵春生.Fe-N/TiN纳米多层膜的结构与力学特性[J].清华大学学报(自然科学版),2002(11):1452-1454,1462. |
| [23] | 邵建达,范正修,殷功杰,易葵,袁利祥.W/C超薄多层膜的制备及其结构与光学特性分析[J].物理学报,1994(12):2016-2022. |
| [24] | 翟宏如;鹿牧;赵宏武 等.多层膜的巨磁电阻[J].物理学进展,1997,17(02):159. |
| [25] | Zelenka J;Chudoba V;Rehak J .Thin resistive film with temperature coefficient of resistive close to zero[J].Thin Solid Films,1991,200(02):239. |
| [26] | 高春华.纳米材料的基本效应及其应用[J].江苏理工大学学报(自然科学版),2001(06):45-49. |
| [27] | 雍岐龙,程莲萍,孙坤,陈华.纳米材料与纳米技术的研究方向及应用前景[J].云南冶金,2001(05):34-37,48. |
| [28] | 高新,李稳宏,王锋,杨清翠.纳米材料的性能及其应用领域[J].石化技术与应用,2002(03):199-201. |
| [29] | KARI KOSKI;Jorma Holsa;Jacques Ernout et al.The connection between sputtering cleaning and adhesion of thin solid films[J].Surface and Coatings Technology,1996,80:195. |
| [30] | 张西鹏,李伟,范洪远.工艺条件对溅射薄膜附着性的影响[J].金属热处理,2003(01):29-31. |
| [31] | 孙亦宁 .中间层对薄膜附着强度的改进[J].真空与低温,1999,5(02):70. |
| [32] | 滕林,杨邦朝,崔红玲,杜晓松.金属薄膜附着性的改进[J].电子元件与材料,2003(06):41-44. |
| [33] | Habib S K;Rizk A;Mousa I A .Physical parameters affecting deposition rates of binary alloys in a magnetron sputtering system[J].Vacuum,1998,49:153. |
| [34] | Wang Y;Xu KW .Characterization of surface morphology of copper tungsten thin film by surface fractal geometry and resistivity[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2004(1/2):310-315. |
| [35] | Tang Wu;Xu Kewei;Wang Ping et al.Surface roughness and resistivity of Au on Si-(111) substrate[J].Microelectronic Engineering,2003,66:445. |
| [36] | 穆杰;张开芳;李玉茹 .集成电路镍铬薄膜的电阻特性与热处理效应[J].半导体情报,1994,31(06):16. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%