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不同取向的锥形棒状Al和Cu单晶体,在不同温度拉伸后,研究了变形量和变形温度与再结晶晶粒取向之间的关系。发现Al单晶体在-78—300℃拉伸时,当充分进入硬化第三阶段后,再结晶晶粒的取向变得集中,与变形母体间有着沿[1(?))转动30°—50°的晶体学关系,但在-196℃拉伸后,再结晶的取向是混乱的。Cu单晶体在20—400℃拉伸后,再结晶的取向也是混乱的。从再结晶晶核就是回复过程中处于领先的、并与周围母体取向差别较大的亚晶长大而成的讨论出发,考虑到Al和Cu的层错能不同,以及Al的层错能随温度降低而减小的现象,并与不同形变硬化阶段的变形机理及变形后的结构相联系,可以对这种再结晶取向关系作出解释。

An investigation was conducted of the relationship between the orientations of recrystallized grains, the deformation amount and the tensile temperature with the tapered single crystals of A1 and Cu. In A1 single crystals, the orientations of recrystallized grains became concentrated when plastic deformation fully entered into the third work hardening stage during tensile test at—78—300℃, and had a crystallographic relationship with the deformed parent in rotating around the [111] about 30—50°, but it was rand random after tensile test at—196℃. In Cu single crystals, the orientations of recrystallized grains were also radom after tensile test at 20—400℃.In consideration of the difference of stacking fault energy in AI and Cu and in A1 with decreasing temperature, the deformed structure in third work hardening stage would be different. From the point of view that the nucleation of recrystallization occurred by the growth of subgrains of large difference in orientation with surrounding matrix and of taking the lead during the recovery process, the different relationship between the orientations of recrystallized grains and the deformed parent can be explained.

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